The quest for novel materials used in technologies demanding extreme performance has
been accelerated by advances in computational materials screening, additive manufacturing …

Silicon (Si) microfabrication techniques, derived from the microelectronics industry, have
enabled the development and commercialization of microelectromechanical systems …

Two-photon lithography (TPL) enables the design of novel micromechanical specimens,
down to sub-micron resolution, thus extending the possibilities for device and material …

A microscopic three-point bending test that measures the strength of faceted particles of high
aspect ratio is developed and used to probe individual coarsened plate-like silicon particles …

The strength distribution and fracture behaviour of miniaturized Lithium niobate (LiNbO 3)
and Lithium tantalate (LiTaO 3) single crystals were assessed under biaxial bending. The …

The etching processes used to produce microelectromechanical systems (MEMS) leave
residual surface features that typically limit device strength and, consequently, device …

The populations of flaws in individual layers of microelectromechanical systems (MEMS)
structures are determined and verified using a combination of specialized specimen …

Silicon nanowire-based sensors find many applications in micro-and nano-
electromechanical systems, thanks to their unique characteristics of flexibility and strength …

Single-crystal silicon test specimens, fabricated by lithography and deep reactive ion etching
(DRIE), were used to measure microscale deformation and fracture properties. The …

This paper reports development of a high-temperature tensile testing machine and testing of
single crystal silicon (SCS) for investigation of the size effect on brittle–ductile transition …