A review: On the development of low melting temperature Pb-free solders
Pb-based solders have been the cornerstone technology of electronic interconnections for
many decades. However, with legislation in the European Union and elsewhere having …
many decades. However, with legislation in the European Union and elsewhere having …
A review of interconnect materials used in emerging memory device packaging: First-and second-level interconnect materials
YS Zou, CL Gan, MH Chung, H Takiar - Journal of Materials Science …, 2021 - Springer
The main motivation of this review is to study the evolution of first and second level of
interconnect materials used in memory device semiconductor packaging. Evolutions of …
interconnect materials used in memory device semiconductor packaging. Evolutions of …
Cu–Sn and Ni–Sn transient liquid phase bonding for die-attach technology applications in high-temperature power electronics packaging
BS Lee, SK Hyun, JW Yoon - Journal of Materials Science: Materials in …, 2017 - Springer
Power electronics modules in electric vehicles and hybrid electric vehicles, particularly those
containing next-generation power semiconductor devices such as silicon carbide and …
containing next-generation power semiconductor devices such as silicon carbide and …
Elimination of voids in reactions between Ni and Sn: A novel effect of silver
Interfacial reaction under in a confined space is becoming an increasingly important issue,
due to its applications for wafer bonding in three-dimensional integrated circuits. This study …
due to its applications for wafer bonding in three-dimensional integrated circuits. This study …
Microstructure characteristics and phase transformations of the Ni-P and Ni-P-Re electroless deposited coatings after heat treatment
J Wojewoda-Budka, A Wierzbicka-Miernik… - Electrochimica …, 2016 - Elsevier
The microstructure and phase composition of Ni-P and Ni-P-Re layers with medium
phosphorus content of 8.8 and 8.2 wt.% of P, respectively, and 6.8 wt.% of Re electroless …
phosphorus content of 8.8 and 8.2 wt.% of P, respectively, and 6.8 wt.% of Re electroless …
[HTML][HTML] Quasi in-situ observation of Ni-plated solder from various fracture mechanism using EBSD
C Wang, K Luo, P He, H Zhou, R Li, Z Zhang… - Journal of Materials …, 2023 - Elsevier
Abstract In this study, Electron Backscattered Diffraction (EBSD) was used to investigate the
blocking effect of novel electroplated Ni in order to inhibit the growth of IMC layers in high …
blocking effect of novel electroplated Ni in order to inhibit the growth of IMC layers in high …
Ni and Ni–P substrates inhibit Bi phase segregation and IMC overgrowth during the soldering process of Sn–Bi solder
M Shang, J Yao, J Xing, X Liu, Y Wang, H Ma… - Materials Chemistry and …, 2024 - Elsevier
In this paper, presents surface modification of Cu substrates by electroplating or chemical
plating to obtain high-quality Ni and Ni–P coatings. The Sn58Bi solder reactions with Cu, Ni …
plating to obtain high-quality Ni and Ni–P coatings. The Sn58Bi solder reactions with Cu, Ni …
Solid-state growth kinetics of Ni3Sn4 at the Sn–3.5 Ag solder∕ Ni interface
Systematic experimental work was carried out to understand the growth kinetics of Ni 3 Sn 4
at the Sn–3.5 Ag solder∕ Ni interface. Sn–3.5% Ag solder was reflowed over Ni …
at the Sn–3.5 Ag solder∕ Ni interface. Sn–3.5% Ag solder was reflowed over Ni …
Interdependent intermetallic compound growth in an electroless Ni-P/Sn-3.5 Ag reaction couple
The interfacial microstructure of electroless Ni-P/Sn-3.5 Ag solder joints was investigated
after reflow and high-temperature solid-state aging to understand its interdependent growth …
after reflow and high-temperature solid-state aging to understand its interdependent growth …
Flux-driven transformations in open systems revisited-crystallization of amorphous Ni-P driven by reaction with Sn
An unexpected example of Flux-Driven Transformation in an open system is treated.
Namely, the transformation of amorphous solution Ni-P into crystalline Ni 3 P with …
Namely, the transformation of amorphous solution Ni-P into crystalline Ni 3 P with …