Conspectus Atomically precise and highly selective surface reactions are required for
advancing microelectronics fabrication. Advanced atomic processing approaches make use …

In recent years, area-selective deposition (ASD) processes have attracted increasing
interest in both academia and industry due to their bottom-up nature, which can simplify …

Area-selective deposition (ASD), a “bottom-up” substrate-selective material deposition
process, is a promising solution to overcome the current limitations experienced in …

Area‐selective atomic layer deposition (ALD) is a promising “bottom‐up” alternative to
current nanopatterning techniques. While it has been successfully implemented in traditional …

The focus of this study was to demonstrate the vapor-phase halogenation of Si (100) and
subsequently evaluate the inhibiting ability of the halogenated surfaces toward atomic layer …

Area selective deposition, which streamlines fabrication steps by enhancing precision and
reliability, represents a cutting-edge, bottom-up atomic and close-to-atomic scale …

Area selective deposition (ASD) is a bottom-up process leading to a uniform deposition in
only desired areas of a patterned substrate, avoiding the use of photolithography for …

Small molecule inhibitors (SMIs) have been gaining attention in the field of area-selective
atomic layer deposition (ALD) because they can be applied in the vapor-phase. A major …

Area‐selective deposition (ASD) shows great promise for sub‐10 nm manufacturing in
nanoelectronics, but significant challenges remain in scaling to ultrasmall dimensions and …

Area-selective atomic layer deposition (AS-ALD) is a technique utilized for the fabrication of
patterned thin films in the semiconductor industry due to its capability to produce uniform …