Emerging trends and obstacles in Damascus processing and electroplating for Chiplet industries: A review
Y Sun, Q Qiu, S Zhang, G Sun, W Yu, L Cao… - Materials Science in …, 2025 - Elsevier
The Chiplet is widely regarded as the most viable continuation of Moore's Law in the
“Beyond Moore” era. This is primarily due to its capability to circumvent complex process …
“Beyond Moore” era. This is primarily due to its capability to circumvent complex process …
Physics-based simulation of stress-induced and electromigration-induced voiding and their interactions in on-chip interconnects
A Kteyan, V Sukharev - Microelectronic Engineering, 2021 - Elsevier
A novel physics-based simulation model of electromigration (EM) and stress-migration (SM)
induced degradation of electrical characteristics of on-chip interconnects is developed …
induced degradation of electrical characteristics of on-chip interconnects is developed …
Experimental validation of a novel methodology for electromigration assessment in on-chip power grids
V Sukharev, A Kteyan, FN Najm, YH Yi… - … on Computer-Aided …, 2021 - ieeexplore.ieee.org
A recently proposed theoretical methodology for the assessment of the electromigration
(EM) induced IR-drop degradation in on-chip power/ground grids has been validated by …
(EM) induced IR-drop degradation in on-chip power/ground grids has been validated by …
Novel physics-based tool-prototype for electromigration assessment in commercial-grade power delivery networks
S Torosyan, A Kteyan, V Sukharev, JH Choy… - Journal of Vacuum …, 2021 - pubs.aip.org
A recently developed novel methodology for electromigration (EM) failure assessment in
power/ground grids of integrated circuits is employed in the electronic design automation …
power/ground grids of integrated circuits is employed in the electronic design automation …
On-Chip Heater Design and Control Methodology for Reliability Testing Applications Requiring Over 300° C Local Temperatures
This paper presents the design details and control methodologies for on-chip heaters that
can provide fast and accurate local temperature control for reliability testing applications …
can provide fast and accurate local temperature control for reliability testing applications …
System-level simulation of electromigration in a 3 nm cmos power delivery network: The effect of grid redundancy, metallization stack and standard-cell currents
A physics-based system-level electromigration (EM) modelling platform is employed to
simulate EM and its impact on the IR drop from the supply voltage to the standard-cells for a …
simulate EM and its impact on the IR drop from the supply voltage to the standard-cells for a …
Design and Experimental Verification of a 6.25 GHz PLL for Harsh Temperature Conditions in 65 nm CMOS Technology
Reliability is an important characteristic of electronic systems, and it could be undermined by
several issues. Among these, a wide temperature range represents a threat to the correct …
several issues. Among these, a wide temperature range represents a threat to the correct …
A Novel System-Level Physics-Based Electromigration Modelling Framework: Application to the Power Delivery Network
Electromigration has been a major reliability concern for nano-interconnects in CMOS
applications. With further CMOS miniaturization, the cross-sectional area of nano …
applications. With further CMOS miniaturization, the cross-sectional area of nano …
[图书][B] Electromigration in Metals: Fundamentals to Nano-Interconnects
Learn to assess electromigration reliability and design more resilient chips in this
comprehensive and practical resource. Beginning with fundamental physics and building to …
comprehensive and practical resource. Beginning with fundamental physics and building to …
A pragmatic network-aware paradigm for system-level electromigration predictions at scale
The standard approach for electro migration (EM) compliance checks of CMOS systems is
based on failure statistics from EM tests on single isolated interconnects. Thus, when …
based on failure statistics from EM tests on single isolated interconnects. Thus, when …