[HTML][HTML] Progress in Research on Co-Packaged Optics

W Tian, H Hou, H Dang, X Cao, D Li, S Chen, B Ma - Micromachines, 2024 - mdpi.com
In the 5G era, the demand for high-bandwidth computing, transmission, and storage has led
to the development of optoelectronic interconnect technology. This technology has evolved …

The future of communications is massively parallel

PJ Winzer - Journal of Optical Communications and Networking, 2023 - opg.optica.org
Over the past decade, high-speed communications technologies have reached severe
scalability limits, from short-reach electrical chip-to-chip interconnects to ultra-long-haul …

[PDF][PDF] 大数据时代光电共封技术的机遇与挑战

卞玲艳, 曾燕萍, 蔡莹, 陆霄, 周倩蓉… - Laser & …, 2024 - researching.cn
摘要人工智能和大数据时代对数据存储, 传输和处理能力的需求日益增加, 数据传输所需带宽和
通信速率也随之增加. 然而系统级封装中的电互连受到介质材料, 传输速率的影响 …

Scalable architecture for sub-pJ/b multi-Tbps comb-driven DWDM silicon photonic transceiver

Y Wang, A Novick, R Parsons, S Wang… - … , Sub-Systems, and …, 2023 - spiedigitallibrary.org
The explosive growth of data-centric artificial intelligence applications calls for the next
generation of optical interconnects for future hyperscale data centers and high-performance …

System development of silicon photonics links for CERN experiments and accelerators

C Scarcella, S Detraz, M Lalović, L Marcon… - Journal of …, 2023 - iopscience.iop.org
Future upgrades of the CERN Experiments and Accelerators require optical links capable of
handling the large data volume generated in particle detectors and beam position (BPMs) …

Energy Efficient and High Bandwidth Quantum Dot Comb Laser based Silicon Microring Transmitter for Optical Interconnects

J Chen, B Yang, J Qin, J Huang, X Cui… - IEEE Journal of …, 2024 - ieeexplore.ieee.org
Explosive development of artificial intelligence has recently driven strong demand of ultra-
large bandwidth interconnects. Optical I/O is considered as a promising approach of …

Silicon Photonics Chip I/O for Ultra High-Bandwidth and Energy-Efficient Die-to-Die Connectivity

Y Wang, S Wang, R Parsons, A Novick… - 2024 IEEE Custom …, 2024 - ieeexplore.ieee.org
Embedded silicon photonics (SiPh) is promising to enable ultra-high bandwidth system-wide
connectivity with vastly reduced energy consumption by integrating optics deeply within …

1.6-Tbps Low-Power Linear-Drive High-Density Optical Interface (HDI/O) for ML/AI

ST Le, G De Valicourt, P Pupalaikis, R Giles… - Optical Fiber …, 2024 - opg.optica.org
1.6-Tbps Low-Power Linear-Drive High-Density Optical Interface (HDI/O) for ML/AI Page 1
1.6-Tbps Low-Power Linear-Drive High-Density Optical Interface (HDI/O) for ML/AI Son Thai …

Exploring Heterogeneous Integration: Its Essence and Future Path

CD Nordquist, SS Chou - Computer, 2024 - ieeexplore.ieee.org
Exploring Heterogeneous Integration: Its Essence and Future Path Page 1 Heterogeneous
integration (HI) is the integra- tion of chiplets using packaging technologies. Whereas a …

Over 100 mW O-band Multi-wavelength DFB Laser Array for Optical I/O Technology

Y Zhang, Z Sun, J Zhao, Z Wang, Z Li… - IEEE Photonics …, 2024 - ieeexplore.ieee.org
We propose and experimentally demonstrate an O-band multi-wavelength high-power DFB
laser array for optical I/O technology. The proposed DFB laser array operates with 400-GHz …