Thermal contact analysis of Flip-Chip package considering microscopic contacts of double-layer thermal interface materials
Flip-chip packaging technology is widely used in the field of electronic packaging. The
thermal contact resistances (TCRs) of its double-layer thermal interface materials (TIMs) …
thermal contact resistances (TCRs) of its double-layer thermal interface materials (TIMs) …
Optimized design of contact interfaces for enhanced heat dissipation in flip-chip package
C Wang, M Qiu, Z Pan, K Zhou, T Wang, J Hong… - Applied Thermal …, 2025 - Elsevier
Flip-chip packaging technology is widely employed in various electronic products, and its
thermal performance plays is crucial in determining the overall efficacy of these devices. The …
thermal performance plays is crucial in determining the overall efficacy of these devices. The …
Analysis of internal and external factors affecting thermal contact resistance from the perspective of entransy dissipation
Traditionally, the research on thermal contact resistance (TCR) is always believes that
temperature boundaries affect TCR by affecting the thermal conductivity, ignoring its own …
temperature boundaries affect TCR by affecting the thermal conductivity, ignoring its own …
Optimization design method of material stiffness of contact interface considering surface roughness for improving thermal contact performance
The contact interface of precision mechanical equipment, such as electronic equipment, is
the crucial medium for transferring internal loads and physical properties and realizing the …
the crucial medium for transferring internal loads and physical properties and realizing the …
[HTML][HTML] Transient thermal regulation mechanisms of composite structures with interface thermal resistance
J Zhao, D Wei, Y Wang, D Liu - Case Studies in Thermal Engineering, 2024 - Elsevier
Thermal rectification is a phenomenon similar to electrical rectification, in which heat transfer
in one direction is favored and reverse heat transfer is hindered. In this study, the finite …
in one direction is favored and reverse heat transfer is hindered. In this study, the finite …
Optimal Design of Contact Interface Material Hardness for Improving Thermal Contact Performance
The material hardness distribution of the contact interface is the core factor affecting the
elastic–plastic contact deformation behavior, and its distribution determines the thermal …
elastic–plastic contact deformation behavior, and its distribution determines the thermal …