Germanium (Ge), with its higher hole and electron mobility than silicon, is a promising
candidate to replace silicon for future complementary metal-oxide-semiconductor (CMOS) …

Integration of graphene with Si microelectronics is very appealing by offering a potentially
broad range of new functionalities. New materials to be integrated with the Si platform must …

The fundamentals of cohesive powder consolidation and flow behavior are explained using
a reasonable combination of particle and continuum mechanics. By the model “stiff particles …

This text treats electronic transport in the regime where conventional textbook models are no
longer applicable, including the effect of electronic phase coherence, energy quantization …

The fundamentals of particle-particle adhesion are presented using continuum mechanics
approaches. The models for elastic (Hertz, Huber, Cattaneo, Mindlin and Deresiewicz) …

The influence of preparation-induced surface roughness, as well as the hydrogen and oxide
coverage on electronic properties of Si (111) and Si (100) surfaces was investigated by …

Special sequences of wet-chemical oxidation and etching steps were optimised with respect
to the etching behaviour of differently oriented silicon to prepare very smooth silicon …

Graphene is a promising candidate for future electronic applications. Manufacturing
graphene‐based electronic devices typically requires graphene transfer from its growth …

In the silicon slicing process, machine vibrations and the unstable wire knife motion cause
the slicing precision to drift, or other ill-conditions. This process involves several …

The further development of an existing approach-to-contact atomic force microscopy (AFM)
method for determining the Hamaker constant, A, of a solid nondeformable material is …