Solder interconnects with various thicknesses of Cu Under Bump Metallization (UBM) were subjected to electromigration and thermal aging tests. Samples with UBM proved to be …
Abstract SAC305 (96.5% Sn-3% Ag-0.5% Cu) is the leading alternative to the traditional Sn- Pb solder eutectic alloy owing to its low melting temperature, better compatibility with other …
YR Kim, AT Osmanson, CU Kim… - 2022 IEEE 72nd …, 2022 - ieeexplore.ieee.org
The previously studied low-frequency pulsed direct current (DC) effects on electromigration (EM) results suggest that non-DC effects on EM mechanisms in solder interconnects are …
The primary concern of this dissertation is the electromigration (EM) failure mechanism found in Sn-Ag-Cu (SAC) solder alloys integrated in WCSP (wafer-level chip scale package) …