Relationship Between the Grain Orientation and the Electromigration Reliability of Electronic Packaging Interconnects

YR Kim, H Madanipour, AT Osmanson… - 2021 IEEE 71st …, 2021 - ieeexplore.ieee.org
Various studies of the electromigration (EM) reliability of solder interconnects have
suggested that early EM failure may have different failure kinetics depending on the grain …

Under Bump Metallization and the Stability of Solder Interconnect Assembly under Thermal and Electrical Load: Refreshed Understanding

H Mohanram, CU Kim, Q Chen… - 2024 IEEE 74th …, 2024 - ieeexplore.ieee.org
Solder interconnects with various thicknesses of Cu Under Bump Metallization (UBM) were
subjected to electromigration and thermal aging tests. Samples with UBM proved to be …

Fabrication of Smooth SAC305 Thin Films via Magnetron Sputtering and Evaluations of Microstructure, Creep, and Electrical Resistivity

M Ojha - 2023 - digitalcommons.odu.edu
Abstract SAC305 (96.5% Sn-3% Ag-0.5% Cu) is the leading alternative to the traditional Sn-
Pb solder eutectic alloy owing to its low melting temperature, better compatibility with other …

Study of Failure and Microstructural Evolution in SAC Solder Interconnects Induced by AC Electromigration Condition

YR Kim, AT Osmanson, CU Kim… - 2022 IEEE 72nd …, 2022 - ieeexplore.ieee.org
The previously studied low-frequency pulsed direct current (DC) effects on electromigration
(EM) results suggest that non-DC effects on EM mechanisms in solder interconnects are …

[图书][B] The Effects of SnAgCu Solder Interconnect Package's Parameters on Electromigration Failure Mechanisms

YR Kim - 2021 - search.proquest.com
The primary concern of this dissertation is the electromigration (EM) failure mechanism
found in Sn-Ag-Cu (SAC) solder alloys integrated in WCSP (wafer-level chip scale package) …