Fluorinated graphene (FG), as an emerging member of the graphene derivatives family, has
attracted wide attention on account of its excellent performances and underlying …

Effective thermal management is quite urgent for electronics owing to their ever-growing
integration degree, operation frequency and power density, and the main strategy of thermal …

The low thermal conductivity coefficient (λ) of polyimide (PI) films are limiting their
application in high-power electronic equipment, and the disordered alignment of fillers …

Recent advances in flexible and stretchable electronics have led to a surge of electronic skin
(e-skin)–based health monitoring platforms. Conventional wireless e-skins rely on rigid …

Research on electronic packaging materials with high electromagnetic interference (EMI)
shielding, thermal conductivity, and electrical insulating properties has been flourishing in …

Polymer-based layered conductive films used in electromagnetic interference (EMI)
shielding and thermal management applications face a huge challenge of high contact …

With the rapid development of wearable electronic devices, multifunctional ultrarobust,
thermoconductive, nonflammable, and electromagnetic interference (EMI) shielding films …

With the development of high power density electronic devices, much more excessive heat
is generated, which puts forward higher requirements for the thermal conductivity (TC) of …

Graphene-based polymer composites possess high thermal conductivity, unfortunately, the
high electrical conductivity of these composites limits their application in electronic devices …

Although graphene-based composites have been considered desirable candidates for
thermal management applications, their poor electrical insulation restricts their further use in …