A magnetic field sensor includes a lead frame having a plurality of leads, at least two of
which have a connection portion and a die attach portion. A semiconductor die is attached to …

(57) ABSTRACT A magnetic field sensor includes a lead frame, a semicon ductor die
supporting a magnetic field sensing element, a non-conductive mold material enclosing the …

US8629539B2 - Methods and apparatus for magnetic sensor having non-conductive die paddle
- Google Patents US8629539B2 - Methods and apparatus for magnetic sensor having …

(57) ABSTRACT A magnetic field sensor includes a lead frame, a semicon ductor die having
a first surface in which a magnetic field sensing element is disposed and a second surface …

(57) ABSTRACT A magnetic field sensor includes a lead frame having a plurality of leads, at
least two of which have a connection portion and a die attach portion. A semiconductor die is …

Aspects are generally directed to systems and methods that integrate contactless electric
field detectors to measure bio physical signals generated by a body. In one example, a …

US8093670B2 - Methods and apparatus for integrated circuit having on chip capacitor with
eddy current reductions - Google Patents US8093670B2 - Methods and apparatus for …

Methods and apparatus for a magnetic field sensor in a molded IC package having a
magnetic field sensing element in a die with a component coupled to a leadframe at a …

US7573112B2 - Methods and apparatus for sensor having capacitor on chip - Google
Patents US7573112B2 - Methods and apparatus for sensor having capacitor on chip …

5,579,194 5,581,179 5,648,682 5,666,004 5,691,869 5,714.405 5,726,577 5,729, 130
5,804,880 5,822,849 5,912,556 5,940.256 5,973,388 6,057,997 6,265,865 6,316,736 …