As the most common of the intermetallic compounds (IMCs) formed between Sn-based
solders and Cu substrates during the packaging of integrated circuits (ICs), Cu 6 Sn 5 is …

The magnetostructural coupling between the structural and the magnetic transition has a
crucial role in magnetoresponsive effects in a martensitic-transition system. A combination of …

Microalloying, in which the solidification structure is preferably and significantly modified by
trace elements, is a key method for improving Pb-free interconnections in electronic devices …

The directional coefficient of thermal expansion (CTE) of intermetallics in electronic
interconnections is a key thermophysical property that is required for microstructure-level …

A Cu 6 Sn 5 layer is an integral part of many electronic interconnections. Here we show that,
although primary Cu 6 Sn 5 is not a potent nucleant for Sn, the Cu 6 Sn 5 layer plays a key …

The present works assesses the knowledge concerning the crystal structures of phases in
the Cu–Sn system having their high relevance due to their occurrence in bronze alloys and …

Cu6Sn5 is an important intermetallic compound used in lead-free soldering and anode
materials for Li-ion batteries. Cu6Sn5 exists in at least two crystal structures, with a …

The improvement of solder joint mechanical performance due to bismuth additions is of
ongoing interest. This paper investigates the influence of 0–14 wt% Bi on microstructure …

Cu 6 Sn 5 is a common intermetallic in Pb-free soldering. We explore the influence of dilute
aluminium additions on the heterogeneous nucleation and grain refinement of primary Cu 6 …

Cu 6 Sn 5 is a critical intermetallic compound in soldering and three-dimensional integrated
circuit packaging technology and exists in at least five different crystal structures in the solid …