Si/Si interconnections, obtained using a Cu metallization and an In interlayer and joined by
diffusion soldering are presented. The Si/Cu/In/Cu/Si bonds were accomplished due to …

Alumina bulks coated with 3μm boron oxide layer were bonded at various temperatures and
times in air. The joining strength, interfacial compounds and morphologies of cross-sections …

This paper presents the design, simulation and fabrication of LTCC-based isothermally
interconnected microhotplate. A thermal electric finite element analysis is used to examine …

In the present work, a tin oxide (SnO 2)-based gas sensor has been fabricated on Low
Temperature Co-fired Ceramic (LTCC) substrate by screen printing method for detection of …

Es wird ein neuer, umweltfreundlicher Lötprozeß für Ni/Ni-Verbindungen vorgestellt, der auf
Diffusionslöten beruht. Hierbei wird reines Sn als Lotmaterial verwendet. Die zustande …

There is a continuing demand for the development of fast, sensitive and reliable sensors for
applications in harsh industrial environments. Gas sensors are finding great importance in …

The In-48 at.% Sn eutectic alloy was used in order to make Cu/Cu interconnection in the
joining process called diffusion soldering. The sequence of intermetalic phases formation …

The electronics is proving valuable assessor to biomedical engineering. Use of
microelectronic devices and chip level micro-systems is finding wider applications in …

Purpose The purpose of this work is to explore the forms of intermetallic phase compounds
(IMPCs) in Pt/In/Au and Pt/In/Ag joints by using isothermal solidification. This lead-free …

The paper presents fundamentals of the diffusion processes occurring in interconnections
produced by means of diffusion soldering. The stages involved in the formation of the …