MEMS package and method of manufacturing the MEMS package
Y Sugizaki - US Patent 8,283,737, 2012 - Google Patents
BACKGROUND US Pat. No. 6,808.955 discloses a method of mounting, in connecting an
MEMS chip and an IC chip, the MEMS chip face-down on the IC chip to reduce a wiring path …
MEMS chip and an IC chip, the MEMS chip face-down on the IC chip to reduce a wiring path …
Integration of piezoelectric materials with substrates
DM Chen, JH Kuypers, A Gaidarzhy… - US Patent …, 2014 - Google Patents
Devices having piezoelectric material structures integrated with substrates are described.
Fabrication techniques for forming Such devices are also described. The fabrication may …
Fabrication techniques for forming Such devices are also described. The fabrication may …
Integration of piezoelectric materials with substrates
DM Chen, JH Kuypers, A Gaidarzhy… - US Patent …, 2013 - Google Patents
Devices having piezoelectric material structures integrated with substrates are described.
Fabrication techniques for forming Such devices are also described. The fabrication may …
Fabrication techniques for forming Such devices are also described. The fabrication may …
Stacked die package for MEMS resonator system
P Gupta, A Partridge, M Lutz - US Patent 8,324,729, 2012 - Google Patents
A stacked die package for an electromechanical resonator system includes a chip that
contains an electromechanical resonator bonded onto the control chip for the …
contains an electromechanical resonator bonded onto the control chip for the …
Thermal sensor using a vibrating MEMS resonator of a chip interconnect layer
MA Abdelmoneum, TM Rahal-Arabi, GF Taylor… - US Patent …, 2014 - Google Patents
Methods and apparatuses for Micro-Electro-Mechanical Systems (MEMS) resonator to
monitor temperature in an integrated circuit. Fabricating the resonator in an interconnect …
monitor temperature in an integrated circuit. Fabricating the resonator in an interconnect …
3D integrated electronic device structure including increased thermal dissipation capabilities
KR Nagarkar, CF Keimel - US Patent 8,698,258, 2014 - Google Patents
BACKGROUND Embodiments presented herein relate to microelectronic device structures
and, more particularly, to three-dimensional (3D) microelectronic integrated circuit (IC) chip …
and, more particularly, to three-dimensional (3D) microelectronic integrated circuit (IC) chip …
Integration of piezoelectric materials with substrates
DM Chen, JH Kuypers, A Gaidarzhy… - US Patent …, 2015 - Google Patents
Devices having piezoelectric material structures integrated with substrates are described.
Fabrication techniques for forming Such devices are also described. The fabrication may …
Fabrication techniques for forming Such devices are also described. The fabrication may …
Stacked die package for MEMS resonator system
P Gupta, A Partridge, M Lutz - US Patent 8,941,247, 2015 - Google Patents
In a packaging structure for a microelectromechanical-sys tem (MEMS) resonator system, a
resonator-control chip is mounted on a lead frame having a plurality of electrical leads …
resonator-control chip is mounted on a lead frame having a plurality of electrical leads …
Stacked die package for MEMS resonator system
P Gupta, A Partridge, M Lutz - US Patent 8,669,664, 2014 - Google Patents
A stacked die package for an electromechanical resonator system includes an
electromechanical resonator die bonded or fixed to a control IC die for the …
electromechanical resonator die bonded or fixed to a control IC die for the …
Stacked-die MEMS resonator system
P Gupta, A Partridge, M Lutz - US Patent 9,821,998, 2017 - Google Patents
In a microelectromechanical system (MEMS) device, a CMOS die is affixed to a die-
mounting surface and wire-bonded to electrically conductive leads, and a MEMS die is …
mounting surface and wire-bonded to electrically conductive leads, and a MEMS die is …