This study presents a design of a 94-GHz high-performance and highly compact frequency-
modulated continuous-wave radar sensor. In this sensor, an-band CMOS-based all-digital …

Novel silicon interposer package solution is proposed for monolithic microwave integrated
circuit (MMIC) heterogeneous integration. The GaAs/InP MMICs are integrated into the high …

Heterogeneous integration allows the use of multiple RF technologies within the same
packaging process. Interconnects are required to transition between different embedded …

In an increasingly electrified, technology-driven world, power electronics is central to the
entire clean energy manufacturing economy. Power switching semiconductor devices are …

This letter presents a Ka-band receiver front end in the form of system in package using
silicon substrate. The front end adopts a dualchannel superheterodyne structure, two GaAs …

Введение. Достижение высоких характеристик радиоэлектронной системы требует
применения комбинации приборов, реализованных на разных полупроводниковых …

This paper demonstrates a S-band 3D surface mount packaged Si and GaN Tx Module
using flip-chip bonding and a chip embedded PCB Substrate. In order to integrate …

In this paper, we present an all-in-one wafer-level solution for MMIC (monolithic microwave
integrated circuit) automatic testing. The OSL (open short load) two tier de-embedding, the …

This paper describes small size 3D structure SiGe-GaN Tx module using chip embedded
substrate. In order to achieve small package size of the Tx module, the GaN device is …

A broad-band single substrate module receiver is built on multi-layer flexible substrate. The
module consists of a Vivaldi antenna array, power combiner, and multilayer filter. The …