Membrane technology coupled with electrocatalytic oxidation processes also known as
membrane-EAOPs became a trendy alternative employed in the treatment of organic …

The aim of the present study is to investigate the electrodeposition of Co-Mo and Co-Mo-P
alloys from the weakly acidic citrate bath and clarify factors influencing the deposition rate …

The paper reveals benefits of multi-disciplinary computer simulation and parametric studies
in the design of silver plating process for improved coating distribution. A finite element …

This study demonstrates a simulation based on a full coupling of electrochemical kinetics
with the 3-dimensional transport of ionic species in a flowing electrolyte through a simplified …

A new avenue for analyzing Ru deposition solution and depositing uniform nano-sized Ru
structures on Pt substrates with enhanced reproducibility is shown in this work. UV–vis …

Copper metallization of semiconductor interconnects hinges on the ability to obtain 'bottom-
up'plating of the sub micron-scale features on the wafer surface. A special additives …

Printed circuit boards (PCBs) are used extensively in electronic products to connect
assembled components within a system. The so-called vertical interconnect access (via) is a …

The deposit thickness uniformity in copper metallized semiconductor wafers is adversely
affected by the limited conductivity of the thin copper seed layer. The resistive substrate …

The Assaf panel arrangement was used for evaluating pulse reverse plating processes and
optimisation of the throwing power (TP) of complex three-dimensional (3D) geometries. Two …

One of the important developments in next generation electronic devices is the technology
for power delivery and heat dissipation. In this study, the Cu-to-Cu flip chip bonding process …