The technique of embedding components inside printed circuit boards (PCBs) is described,
using different filling masses. To investigate the possibility of placing the components inside …

Abstract Classification experiments using Sn0. 3Ag0. 7Cu lead-free solder powder prepared
by supersonic gas atomization were conducted by turbo air classifier. The effects of rotor …

Purpose–The purpose of this paper is to present challenges met during package-on-
package (PoP) technology implementation in real surface-mount technology assembly …

As the miniaturization of the devices is progressing the chips have to have more functions
and cover less space. One of the methods to achieve this goal is usage of Package-on …

Purpose The purpose of this paper is to evaluate the influence of solder powders sizes
applied in soldering materials used for Package-on-Package (PoP) system manufacture as …

For system manufacturers, packaging of the ball grid array (BGA) of wireless communication
modules can be performed via solder paste printing. As reballing can be conducted via the …

In this study, the effect of growth microstructure on diffusion and intermetallic compound of
Sn-58Bi/SAC305 solder joint with different of SAC305 size and reflow temperature had been …

In the transition to lead-free process, one of the most prominent problems is the lead-free
solder joint interconnection reliability. Interconnection failure analysis is an important tool for …

With the never ending drive for smaller, lighter and more advanced features on handheld
products, Package on Package (PoP) assembly that integrates logic die in the bottom …

A typical early fault case of some mobile phones was studied in this paper. The failure
phenomenon was manifested as that the mobile phones could not be powered on after one …