Transfer printing for silicon photonics

B Corbett, R Loi, J O'Callaghan, G Roelkens - Semiconductors and …, 2018 - Elsevier
Silicon-based photonics allows thousands of optical components to be integrated. It
provides a path to the development of scalable, low-cost photonic integrated circuits akin to …

Thermal analysis of InP lasers transfer printed to silicon photonics substrates

R Loi, J O'Callaghan, B Roycroft, Z Quan… - Journal of Lightwave …, 2018 - ieeexplore.ieee.org
The thermal performance of Fabry-Perot InP lasers integrated onto different silicon photonics
substrates by microtransfer printing is assessed. 500-μm-long ridge waveguide lasers on the …

Drift-diffusion simulation of high-speed optoelectronic devices

I Pisarenko, E Ryndin - Electronics, 2019 - mdpi.com
In this paper, we address the problem of research and development of the advanced
optoelectronic devices designed for on-chip optical interconnections in integrated circuits …

Chip-scale optical interconnect using microLEDs

B Pezeshki, R Kalman - US Patent 11,515,356, 2022 - Google Patents
In package intra-chip and/or inter-chip optical communica tions are provided using
microLEDs and photodetectors mounted to integrated circuit (IC) chips and/or to transceiver …

Optically-enhanced multichip packaging

R Kalman, B Pezeshki, A Tselikov… - US Patent 11,728,894, 2023 - Google Patents
Optical chip-to-chip interconnects may use microLEDs as light sources. The interconnected
chips may be on a same substrate. A pair of endpoint chips may each have associated …

Packaging for microLEDs for chip to chip communication

B Pezeshki, R Kalman, A Tselikov - US Patent 11,513,285, 2022 - Google Patents
US11513285B2 - Packaging for microLEDs for chip to chip communication - Google
Patents US11513285B2 - Packaging for microLEDs for chip to chip communication …

Chip-scale optical interconnect using microLEDs

B Pezeshki, R Kalman - US Patent 12,074,192, 2024 - Google Patents
In package intra-chip and/or inter-chip optical communications are provided using
microLEDs and photodetectors mounted to integrated circuit (IC) chips and/or to transceiver …

Packaging for microLEDs for chip to chip communication

B Pezeshki, R Kalman, A Tselikov - US Patent 11,835,758, 2023 - Google Patents
US11835758B2 - Packaging for microLEDs for chip to chip communication - Google
Patents US11835758B2 - Packaging for microLEDs for chip to chip communication …

Parallel optical communication channels using microLEDs

RT Weverka, R Kalman, B Pezeshki… - US Patent …, 2024 - Google Patents
US11916598B2 - Parallel optical communication channels using microLEDs - Google
Patents US11916598B2 - Parallel optical communication channels using microLEDs …

LED array for in-plane optical interconnects

M Krames, B Pezeshki, R Kalman… - US Patent 11,605,618, 2023 - Google Patents
An LED array on a sapphire substrate may be mounted on a silicon interconnect chip, with
LEDs of the array inserted into holes of waveguides on the silicon interconnect chip. The …