Study of electromigration in Sn-Ag-Cu micro solder joint with Ni interfacial layer
This paper reports the extreme sensitivity of the microstructure evolution in Sn-Ag-Cu (SAC)
micro-solder joint, consisting of 15–20 µm thick solder alloy and electrolytic Ni plated Cu …
micro-solder joint, consisting of 15–20 µm thick solder alloy and electrolytic Ni plated Cu …
Kinetics of Ni solid-state dissolution in Sn and Sn3. 5Ag alloys
JY Wang, YK Tang, CY Yeh, PJ Chang, YX Lin… - Journal of Alloys and …, 2019 - Elsevier
This study investigates the kinetics of solid-state dissolution of Ni into Sn and Sn3. 5Ag
solders. At annealing temperatures of 150, 180, and 200° C for 100–400 h, more amount of …
solders. At annealing temperatures of 150, 180, and 200° C for 100–400 h, more amount of …
Tight-Pitched 10 μm-Width Solder Joints for c-2-c and c-2-w 3D-Integration in NCF Environment
M Mariappan, S Fukuzumi, T Shibata… - 2022 IEEE 72nd …, 2022 - ieeexplore.ieee.org
Solder micro-joint (μ-joint) fenced with non-conducting film (NCF) under tight pitch
configuration has been studied for its thermal and electrical stability after chip-to-chip and …
configuration has been studied for its thermal and electrical stability after chip-to-chip and …
Semiconductor device
K Sakata, T Akiba, T Funaya, H Tsuchiya… - US Patent …, 2021 - Google Patents
US11063009B2 - Semiconductor device - Google Patents US11063009B2 - Semiconductor
device - Google Patents Semiconductor device Download PDF Info Publication number …
device - Google Patents Semiconductor device Download PDF Info Publication number …
Failure Analysis in Advanced Driver Assistance Systems
Y Li, H Shi - Advanced Driver Assistance Systems and Autonomous …, 2022 - Springer
Failure analysis (FA) could provide timely feedback to process optimization and solution
paths for system failures; thus, it is critical for the development of advanced driver assistance …
paths for system failures; thus, it is critical for the development of advanced driver assistance …
Solder Electromigration Failure Time as a function of the Angle between the c-axis of Sn Crystals and Direction of Electron Flow
T Sakai, E Watanabe, T Sei… - … Packaging and iMAPS …, 2018 - ieeexplore.ieee.org
Electromigration (EM) in Sn-based solder joints is recognized as a major reliability problem
in high performance semiconductor devices in the current microelectronics area and in …
in high performance semiconductor devices in the current microelectronics area and in …
A comparison study of Cu dissolution mechanism and kinetics in solder joints under electromigration and extended reflow
D Goyal, P Liu, A Overson - 2018 IEEE 68th Electronic …, 2018 - ieeexplore.ieee.org
Comparisons of Cu dissolution mechanism and kinetics between solder joints under
electromigration (EM) and extended reflow have been studied. Cu consumption rate varies …
electromigration (EM) and extended reflow have been studied. Cu consumption rate varies …
Failure mechanism and kinetics studies of electroless Ni-P dissolution in Pb-free solder joints under electromigration
P Liu, C Chavali, A Overson… - 2017 IEEE 67th Electronic …, 2017 - ieeexplore.ieee.org
Electromigration (EM) of Pb-free SnCu solder joints with NiPdAu surface finishes are
studied. The failure mechanism and kinetics of electroless Ni-P dissolution under EM are …
studied. The failure mechanism and kinetics of electroless Ni-P dissolution under EM are …
Electromigration induced interfacial microstructure evolution of solder joints in electronic packaging
P Liu, A Overson, D Goyal - 2020 IEEE 70th Electronic …, 2020 - ieeexplore.ieee.org
Electromigration (EM) of eutectic SnBi and SnCu solder joints with NiPdAu surface finish are
studied at temperatures above their melting points. The interfacial microstructure evolutions …
studied at temperatures above their melting points. The interfacial microstructure evolutions …
Significant consumption of Ni-P layer in Ni-P/Sn-0.7 Cu solder joints during thermomigration
S Oya, H Tatsumi, H Nishikawa - … International Conference on …, 2023 - ieeexplore.ieee.org
Thermomigration is atomic diffusion driven by a temperature gradient in binary alloys and its
effect in solder joints at 200° C for SiC power modules is still unclear. This study investigates …
effect in solder joints at 200° C for SiC power modules is still unclear. This study investigates …