This review paper covers a topic of significant importance in micro-and nano-systems
development and manufacturing, specifically the residual stresses in deposited thin-film …

It is difficult to meet all the different material and economical requirements posed to a MEMS
structural layer that can be integrated with the electronics on the same substrate using a …

A range of physical properties can be achieved in micro-electro-mechanical systems
(MEMS) through their encapsulation with solid-state, ultra-thin coatings. This paper reviews …

In this article materials issues that arise during the processing and operation of micro-electro
mechanical systems devices (MEMS), and their impact on the functionality and reliability, are …

CMOS-MEMS integration can improve the performance of the MEMS (micro-
electromechanical systems), allows for smaller packages and leads to a lower packaging …

Low-thermal-budget, electrically active, and thick polysilicon films are necessary for building
a microelectromechanical system (MEMS) on top of a complementary metal oxide …

A series of new mixed-substituted heteronuclear precursors with preformed Si–Ge bonds
has been synthesized via a two-step synthesis protocol. The molecular sources combine …

The integration of complementary metal oxide semiconductor (CMOS) and
microelectromechanical systems (MEMS) can improve the performance of the MEMS, allows …

In this paper, we demonstrate eliminating the stress gradient in polycrystalline silicon
germanium films at temperatures compatible with standard CMOS (Al interconnects) …

In this overview article several MEMS applications of poly-SiGe are discussed: thermal
applications, the application as a capping layer for MEMS wafer-level packaging and the …