A review of mechanical properties of lead-free solders for electronic packaging
H Ma, JC Suhling - Journal of materials science, 2009 - Springer
The characterization of lead-free solders, especially after isothermal aging, is very important
in order to accurately predict the reliability of solder joints. However, due to lack of …
in order to accurately predict the reliability of solder joints. However, due to lack of …
Critical properties of Cu6Sn5 in electronic devices: Recent progress and a review
As the most common of the intermetallic compounds (IMCs) formed between Sn-based
solders and Cu substrates during the packaging of integrated circuits (ICs), Cu 6 Sn 5 is …
solders and Cu substrates during the packaging of integrated circuits (ICs), Cu 6 Sn 5 is …
Recrystallization and precipitate coarsening in Pb-free solder joints during thermomechanical fatigue
The recrystallization of β-Sn profoundly affects deformation and failure of Sn-Ag-Cu solder
joints in thermomechanical fatigue (TMF) testing. The numerous grain boundaries of …
joints in thermomechanical fatigue (TMF) testing. The numerous grain boundaries of …
Effects of Cu, Bi, and In on microstructure and tensile properties of Sn-Ag-X (Cu, Bi, In) solders
ML Huang, L Wang - Metallurgical and Materials Transactions A, 2005 - Springer
Abstract Effects of minor additions of Cu, Bi, and In on microstructure, melting temperature,
and tensile properties of Sn-Ag-based lead-free solders were investigated. It was found that …
and tensile properties of Sn-Ag-based lead-free solders were investigated. It was found that …
Microstructural coarsening in Sn-Ag-based solders and its effects on mechanical properties
Abstract Solders based on Sn-Ag alloys are susceptible to microstructural coarsening during
storage or service, resulting in evolution of joint properties, and hence reliability, over time …
storage or service, resulting in evolution of joint properties, and hence reliability, over time …
Intermetallic size and morphology effects on creep rate of Sn-3Ag-0.5 Cu solder
The creep behaviour of directionally solidified SAC305 (96.5 Sn-3Ag-0.5 Cu wt%) alloy has
been investigated with integrated particle matrix composite (PMC) crystal plasticity …
been investigated with integrated particle matrix composite (PMC) crystal plasticity …
Complexity and evolution of a three-phase eutectic during coarsening uncovered by 4D nano-imaging
We investigate the coarsening dynamics of the three-phase eutectic Al-Ag 2 Al-Al 2 Cu at
723 K via in situ transmission X-ray nano-tomography. Unlike previous investigations that …
723 K via in situ transmission X-ray nano-tomography. Unlike previous investigations that …
Corrosion behaviour assessment of lead-free Sn–Ag–M (M= In, Bi, Cu) solder alloys
F Rosalbino, E Angelini, G Zanicchi… - Materials Chemistry and …, 2008 - Elsevier
The corrosion behaviour of lead-free Sn88. 7Ag2. 3In9. 0, Sn86. 6Ag3. 0Bi10. 4, Sn96.
1Ag3. 1Cu0. 8 and Sn90. 4Ag2. 9Cu6. 7 solder alloys was investigated in 0.1 M NaCl …
1Ag3. 1Cu0. 8 and Sn90. 4Ag2. 9Cu6. 7 solder alloys was investigated in 0.1 M NaCl …
Novel interface regulation of Sn1. 0Ag0. 5Cu composite solders reinforced with modified ZrO2: microstructure and mechanical properties
F Huo, Z Jin, D Le Han, J Li, K Zhang… - Journal of Materials …, 2022 - Elsevier
With the trends of miniaturization and high density of electronic packaging, there has been
an urgent demand to open up lead-free solders with high strength and ductility. In this study …
an urgent demand to open up lead-free solders with high strength and ductility. In this study …
Visualization of microstructural evolution in lead free solders during isothermal aging using time-lapse imagery
N Fu, S Ahmed, JC Suhling… - 2017 IEEE 67th Electronic …, 2017 - ieeexplore.ieee.org
In this investigation, Scanning Electron Microscopy (SEM) and Scanning Probe Microscopy
(SPM) have been utilized to examine aging induced microstructural changes occurring …
(SPM) have been utilized to examine aging induced microstructural changes occurring …