Purpose–The purpose of this paper is to study the thermal warpage of a plastic ball grid
array (PBGA) mounted on a printed circuit board (PCB) during the reflow process …

Down to the road of speed, complexity, and miniaturization, ball grid array (BGA) design has
been introduced into electronic industry due to its higher I/O density. However, the …

In recent years, Package on Package (PoP), in which a top memory packaging system is
connected to a bottom logic package via solder joint, is a System-in-Package (SiP) solution …

Top package with stacked memory die connected to a bottom logic package via solder balls
is a representative PoP configuration. This POP configuration has become very popular in …

Modeling can efficiently investigate the reliability of new packages, saving time, manpower,
and cost for conducting actual tests; A good model is useful for short time-to-market. In this …

研制一种用于无线传感网的多芯片组件(3 犇 犕犆犕). 采用层压, 开槽等工艺获得埋置式高密度
多层有机(犉犚 4) 基板, 通过板上芯片(犆犗犅), 板上倒装芯片(犉犆犗犅), 球栅阵列(犅犌犃) …

In this paper, four modeling approaches such as InsCTE, MeanCTE, EqvCTE and
CureCTE+ MeanCTE, were employed to predict the substrate warpage. Both laminate and …

The feasibility of embedded interposer carrier (EIC) has been proposed and developed to
improve the assembly process of three-dimensional (3D) integrated circuits (3D-ICs) …

One of the most prominent failure modes in microelectronics devices is the delamination of
epoxy materials (adhesives, molding compounds). The thermal mismatch at the interface …

采用粘塑性有限元焊球模型以及大形变理论研究了三维多芯片组件(3D-MCM)
的翘曲形态特征及其成因, 结果表明基板腔室的存在使埋置式基板形成了双弓形翘曲形态 …