State of the art of lead-free solder joint reliability
JH Lau - Journal of Electronic Packaging, 2021 - asmedigitalcollection.asme.org
The state of the art of lead-free solder joint reliability is investigated in this study. Emphasis is
placed on the design for reliability (DFR) and reliability testing and data analysis. For …
placed on the design for reliability (DFR) and reliability testing and data analysis. For …
Solder joint failures under thermo-mechanical loading conditions–A review
Solder joints play a critical role in electronic devices by providing electrical, mechanical and
thermal interconnections. These miniature joints are also the weakest links in an electronic …
thermal interconnections. These miniature joints are also the weakest links in an electronic …
[HTML][HTML] A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints
This paper presents a multi-scale modelling approach to investigate the underpinning
mechanisms of microstructure-sensitive damage of single crystal Sn-3Ag-0.5 Cu (wt …
mechanisms of microstructure-sensitive damage of single crystal Sn-3Ag-0.5 Cu (wt …
Equilibrium phase diagram design and structural optimization of SAC/Sn-Pb composite structure solder joint for preferable stress distribution
S Xu, X Jing, P Zhu, H Jin, KW Paik, P He… - Materials …, 2023 - Elsevier
Abstract The Package-on-Package (PoP) technology is an efficient knowhow to increase the
efficiency of electronic components, hence to secure the continuation of the validity of …
efficiency of electronic components, hence to secure the continuation of the validity of …
[HTML][HTML] High temperature viscoplastic deformation behavior of sintered nanocopper paste used in power electronics packaging: insights from constitutive and multi …
As a promising technology for high-power and high-temperature power electronics
packaging, nanocopper (nanoCu) paste sintering has recently received increasing attention …
packaging, nanocopper (nanoCu) paste sintering has recently received increasing attention …
Correlation of reliability models including aging effects with thermal cycling reliability data
The microstructure, mechanical response, and failure behavior of lead free solder joints in
electronic assemblies are constantly evolving when exposed to isothermal aging and/or …
electronic assemblies are constantly evolving when exposed to isothermal aging and/or …
High strain rate constitutive behavior of SAC105 and SAC305 leadfree solder during operation at high temperature
Industry migration to leadfree solders has resulted in a proliferation of a wide variety of
solder alloy compositions. The most popular amongst these are the Sn–Ag–Cu family of …
solder alloy compositions. The most popular amongst these are the Sn–Ag–Cu family of …
Finite element analysis of the effect of process-induced voids on the fatigue lifetime of a lead-free solder joint under thermal cycling
Process-induced voids remain one of the key concerns in thermo-mechanical reliability of
solder alloys. Previous studies reported that the void effect on fatigue failure reliability of …
solder alloys. Previous studies reported that the void effect on fatigue failure reliability of …
The effects of aging on the Anand viscoplastic constitutive model for SAC305 solder
Lead free solder materials are widely used in electronic packaging industry due to
environmental concerns. However, experimental testing and microstructural characterization …
environmental concerns. However, experimental testing and microstructural characterization …
[HTML][HTML] Study of the effect of crystal orientation on the mechanical response and fatigue life of solder joints under thermal cycling by crystal plasticity
M Xie, G Chen, X Yuan, L Zhang, Q Lin - Journal of Materials Research and …, 2023 - Elsevier
Electronic products are subjected to thermal cycling caused by power cycling in service
processes. Owing to the difference in the coefficients of thermal expansion (CTEs) of solder …
processes. Owing to the difference in the coefficients of thermal expansion (CTEs) of solder …