InP is currently being used in various (opto) electronic and energy device applications.
However, the high cost of InP substrates and associated epitaxial growth techniques has …

This work expands upon previous research related to transfer printed virtual substrates: a
technique for generating low-cost engineered substrates that is not based on wafer reuse …

We demonstrate a novel concept for III-V engineered substrate cost reduction that does not
rely on chemical-mechanical polishing or low-throughput release layer etching. With the …

Transfer printed virtual substrates (TPVS) is a promising technique for drastic III-V substrate
cost reduction. In this work, we grew a three-period stack of GaAs virtual substrates on a …

Micro-transfer printing has demonstrated value for device-and array-level heterogeneous
integration in a variety of applications. Here, it is used instead to assemble unique …

Virtual substrates formed by integrating high quality, micro-scale III-V epitaxial template
layers with cheap handle materials using transfer printing offer a pathway to very low cost III …