Interconnect scaling has become a major design challenge for traditional planar (2D)
integrated circuits (ICs). Three-dimensional (3D) IC that stacks multiple device layers …

Abstract Network-on-chips (NoCs) have been widely employed in the design of
multiprocessor system-on-chips (MPSoCs) as a scalable communication solution. NoCs …

The energy issue of real-time applications with precedence-constrained tasks on
heterogeneous systems has been studied recently. With the strikingly increasing power …

The continuous scaling of silicon technology has enabled many-core systems to become
ubiquitous, offering enormous computational power for various applications spanning from …

Abstract Three-dimensional (3D) multicore chips have been recently developed to deal with
the power consumption and interconnection delay problems of embedded systems; …

Because the increasing power density is limited by the thermal constraint, multi-core
integrated systems have stepped into the dark silicon era recently, meaning not all parts of …

In this paper, we propose a two-stage thermal-aware task scheduling policy which exploits
the application and system architecture characteristics to decouple the mapping of task …

Three-dimensional network-on-chip (NoC) is the primary interconnection method for 3D-
stacked multicore processors due to their excellent scalability and interconnect flexibility …

3-D multiprocessor system-on-chip (MPSoC) systems can offer higher integration density,
lower interaction cost, better bandwidth, and greater performance. However, vertically …

For the past several decades, we have experienced the tremendous growth, in both scale
and scope, of real-time embedded systems, thanks largely to the advances in IC technology …