N Fu, S Ahmed, JC Suhling… - 2017 IEEE 67th Electronic …, 2017 - ieeexplore.ieee.org
In this investigation, Scanning Electron Microscopy (SEM) and Scanning Probe Microscopy (SPM) have been utilized to examine aging induced microstructural changes occurring …
Lead free solder materials are susceptible to significant creep deformations in harsh high temperature environments including automotive, avionics, military, and oil exploration …
The mechanical behavior of lead free solder materials is often represented using the Anand viscoplastic constitutive model. This nine parameter model is built into popular commercial …
One of the most common method of failure in electronic packaging is the fatigue failure of solder joints. The constituent materials forming the electronic assembly have different …
Due to growing environmental concerns, lead-free solder materials are being widely used in electronic assemblies. The Anand viscoplastic constitutive model is frequently used to …
In this investigation, the effects of isothermal mechanical cycling on damage accumulation in lead free SAC305 and SAC_Q (SAC+ Bi) solder joints have been explored. In particular, we …
In this work, we have used nanoindentation methods to explore the creep behavior, and aging effects of SAC305 solder joints at several elevated testing temperatures from 25 to …
N Fu, JC Suhling, P Lall - 2016 IEEE 66th Electronic …, 2016 - ieeexplore.ieee.org
Solder joints in electronic assemblies are often subjected to cyclic (positive/negative) mechanical strains and stresses. Such exposures can occur in variable temperature …
The mechanical properties and constitutive behaviors of lead free solders are highly dependent on temperature. Properties of high interest include the initial effective elastic …