Reliability, applications and challenges of GaN HEMT technology for modern power devices: A review

N Islam, MFP Mohamed, MFAJ Khan, S Falina… - Crystals, 2022 - mdpi.com
A new generation of high-efficiency power devices is being developed using wide bandgap
(WBG) semiconductors, like GaN and SiC, which are emerging as attractive alternatives to …

GaN-based diodes and transistors for chemical, gas, biological and pressure sensing

SJ Pearton, BS Kang, S Kim, F Ren… - Journal of Physics …, 2004 - iopscience.iop.org
There is renewed emphasis on development of robust solid-state sensors capable of
uncooled operation in harsh environments. The sensors should be capable of detecting …

GaN-based RF power devices and amplifiers

UK Mishra, L Shen, TE Kazior… - Proceedings of the IEEE, 2008 - ieeexplore.ieee.org
The rapid development of the RF power electronics requires the introduction of wide
bandgap material due to its potential in high output power density, high operation voltage …

An assessment of wide bandgap semiconductors for power devices

JL Hudgins, GS Simin, E Santi… - IEEE Transactions on …, 2003 - ieeexplore.ieee.org
An advantage for some wide bandgap materials, that is often overlooked, is that the thermal
coefficient of expansion (CTE) is better matched to the ceramics in use for packaging …

Band offsets of high K gate oxides on III-V semiconductors

J Robertson, B Falabretti - Journal of applied physics, 2006 - pubs.aip.org
III-V semiconductors have high mobility and will be used in field effect transistors with the
appropriate gate dielectric. The dielectrics must have band offsets over 1 eV to inhibit …

GaN metal-oxide-semiconductor high-electron-mobility-transistor with atomic layer deposited Al2O3 as gate dielectric

PD Ye, B Yang, KK Ng, J Bude, GD Wilk… - Applied Physics …, 2005 - pubs.aip.org
We report on a GaN metal-oxide-semiconductor high-electron-mobility-transistor (MOS-
HEMT) using atomic-layer-deposited (ALD) Al 2 O 3 as the gate dielectric. Compared to a …

State of the art on gate insulation and surface passivation for GaN-based power HEMTs

T Hashizume, K Nishiguchi, S Kaneki, J Kuzmik… - Materials science in …, 2018 - Elsevier
In this article, we review recent progress on AlGaN/GaN and InAlN/GaN metal-insulator-
semiconductor high-electron-mobility transistors (MIS-HEMTs) using Al-based oxides, nitride …

AlGaN/GaN metal–oxide–semiconductor heterostructure field-effect transistors on SiC substrates

MA Khan, X Hu, A Tarakji, G Simin, J Yang… - Applied Physics …, 2000 - pubs.aip.org
We report on AlGaN/GaN metal–oxide–semiconductor heterostructure field-effect transistors
(MOS-HFETs) grown over insulating 4H–SiC substrates. We demonstrate that the dc and …

[图书][B] The RF and microwave handbook

M Golio - 2000 - taylorfrancis.com
The recent shift in focus from defense and government work to commercial wireless efforts
has caused the job of the typical microwave engineer to change dramatically. The modern …

An AlN/Al0. 85Ga0. 15N high electron mobility transistor

AG Baca, AM Armstrong, AA Allerman… - Applied Physics …, 2016 - pubs.aip.org
An AlN barrier high electron mobility transistor (HEMT) based on the AlN/Al 0.85 Ga 0.15 N
heterostructure was grown, fabricated, and electrically characterized, thereby extending the …