In this article, a low-loss RF coaxial through-silicon vias (TSVs)(C-TSVs) configuration in the
silicon interposer with the embedded cooling cavity is proposed. For the single C-TSV array …

This study establishes a unit cell model of thermal-mechanical coupling of 3D chip thermal
through-silicon via (TTSV), and conducts optimization study under the constraints of the …

Through-silicon-via (TSV)-based coaxial line techniques can reduce the high-frequency loss
due to the low resistivity in the silicon substrate and thus can improve the efficiency of …

Enhancing the integration of directional couplers is a crucial challenge in the design of
wireless communication circuits and systems. This article proposes a design strategy based …

Abstract Through-Silicon-Via (TSV) is an significant technology that is being widely
employed in micro-electro-mechanical system (MEMS) manufactories. However, it is remain …

Compared to conventional through-silicon-via (TSV) technology, coaxial TSVs can provide
better radio frequency (RF) transmission performance in terms of reduced transmission loss …

Purpose Concerning the radiation effects on the three-dimensional (3D) packaging in space
environment, this study aims to investigate the influence of the total dose effect on the …

In this work, a method for developing a lumped-element circuit macro-modeling of
micro/millimeter-wave flip-chip ball interconnects is proposed. The developed macro-model …

This paper provides a comparative study of packaging features of a high-speed silicon-
germanium (SiGe) integrated circuit (IC). Two variants of a 64-Gb/s optical receiver (ORX) …

本文基于硅基三维集成技术, 提出了一种高集成度低剖面的W 频段有源相控阵微系统.
将阵列划分为若干个2× 4 单元的W 频段相控阵子阵微系统. 每个子阵微系统采用了三维布局 …