A review of short circuit performance in 650 V power devices: SiC MOSFETs, silicon super-junction MOSFETs, SiC cascode JFETs, silicon MOSFETs and silicon IGBTs

E Bashar, N Agbo, R Wu, S Mendy… - PCIM Europe 2022; …, 2022 - ieeexplore.ieee.org
Using measurements, a comprehensive analysis is performed on the short circuit (SC)
performance and robustness of 650V power devices including SiC MOSFETs, SiC Cascode …

Power converters coolant: past, present, future, and a path toward active thermal control in electrified ship power systems

A Moghassemi, SMI Rahman, G Ozkan… - IEEE …, 2023 - ieeexplore.ieee.org
Power converters have widespread applications in automotive, renewables, and power
systems. The demand for power modules with low power consumption and high efficiency …

Junction Temperature Extraction for Silicon Carbide Power Devices: A Comprehensive Review

H Wen, X Li, F Zhang, Z Qu, Y Jiang… - … on Power Electronics, 2024 - ieeexplore.ieee.org
The complete replacement of silicon devices with silicon carbide (SiC) devices still faces
many reliability challenges considering higher cost, higher junction temperature, and its …

Current sharing of parallel sic mosfets under short circuit conditions

R Wu, S Mendy, JO Gonzalez, S Jahdi… - 2021 23rd European …, 2021 - ieeexplore.ieee.org
Device-to-device parametric variations (eg threshold voltage V TH, gate resistance RG and
junction temperature TJ) can cause variations in the short-circuit currents conducted through …

Performance of parallel connected sic mosfets under short circuits conditions

R Wu, S Mendy, N Agbo, JO Gonzalez, S Jahdi… - Energies, 2021 - mdpi.com
This paper investigates the impact of parameter variation between parallel connected SiC
MOSFETs on short circuit (SC) performance. SC tests are performed on parallel connected …

Time-dependent degradation mechanism of 1.2 kV SiC MOSFET under long-term high-temperature gate bias stress

Y Shen, Z He, Y Shi, H Niu, Y Chen… - … on Electron Devices, 2022 - ieeexplore.ieee.org
This work investigates the degradation mechanism of 1.2 kV silicon carbide (SiC) metal
oxide semiconductor field-effect transistor (MOSFET) under positive or negative long-term …

A junction temperature and package aging decoupling evaluating method for SiC MOSFETs based on the turn-on drain-source current overshoot

Q Zhang, P Zhang - IEEE Transactions on Power Electronics, 2023 - ieeexplore.ieee.org
Junction temperature and package aging levels are key factors related to the reliability of
SiC metal oxide semiconductor field effect transistors (mosfet s). Many methods have been …

On-line Temperature Measurement Method for SiC MOSFET Device based on Gate Pulse

X Meng, M Zhang, S Feng, Y Tang… - IEEE Transactions on …, 2024 - ieeexplore.ieee.org
In this article, a new online temperature measurement method for silicon carbide power
metal–oxide–semiconductor field-effect transistors (mosfet s) is proposed that uses the …

Challenges of Junction Temperature Calibration of SiC MOSFETs for Power Cycling–a Dynamic Approach

J Breuer, F Dresel, A Schletz, J Klier… - CIPS 2024; 13th …, 2024 - ieeexplore.ieee.org
For thermal impedance measurement (Zth) and power cycle testing (PCT) of semiconductor
power packages, a precise measurement of the junction temperature is essential and critical …

Third Quadrant Operation of SiC MOSFETs: Comprehensive Analysis and Condition Monitoring Solution

R Sajadi, E Ugur, M Farhadi… - IEEE Transactions …, 2024 - ieeexplore.ieee.org
To achieve higher power density at a reduced cost, it is more advantageous to utilize the
inherent body diode found in silicon carbide MOSFETs (SiC MOSFETs) rather than relying …