Defect detection of flip chip solder bumps with wavelet analysis of laser ultrasound signals
J Yang, IC Ume, L Zhang - IEEE Transactions on advanced …, 2009 - ieeexplore.ieee.org
Microelectronics packaging technology has evolved from through-hole and bulk
configuration to surface-mount and small-profile ones. In surface mount packaging, such as …
configuration to surface-mount and small-profile ones. In surface mount packaging, such as …
In-situ diagnosis of solder joint failure by means of thermal resistance measurement
Z Li, K Fushinobu, H Haketa, R Yasui… - Microelectronics …, 2021 - Elsevier
Solder connections provide an electrical and mechanical connection between components
and PCB (Printed Circuit Board) in electronic devices. It is very important to develop a …
and PCB (Printed Circuit Board) in electronic devices. It is very important to develop a …
Online-offline laser ultrasonic quality inspection tool for multilayer ceramic capacitors-Part II
DS Erdahl, IC Ume - IEEE transactions on advanced packaging, 2005 - ieeexplore.ieee.org
The adoption of surface mount technology has provided many competitive advantages for
the electronics industry. Smaller, lighter, and more efficient packages create better products …
the electronics industry. Smaller, lighter, and more efficient packages create better products …
Determination of measurement limit for open solder bumps on a flip-chip package using a laser ultrasonic inspection system
DS Erdahl, IC Ume - IEEE transactions on advanced packaging, 2006 - ieeexplore.ieee.org
The adoption of surface-mount technology has spurred a rapid decrease in the size of
electronic packages. Advanced active component packages, such as flip-chips, chip scale …
electronic packages. Advanced active component packages, such as flip-chips, chip scale …
[图书][B] Microelectronic device inspection system implementation and modeling for flip chips and multi-layer ceramic capacitors
DS Erdahl - 2005 - search.proquest.com
Increased demand for smaller electronics is driving the electronic packaging industry to
develop smaller, more efficient component level packages. Surface mounted components …
develop smaller, more efficient component level packages. Surface mounted components …