Insight into the Influence of Punch Velocity and Thickness on Forming Limit Diagrams of AA 6061 Sheets—Numerical and Experimental Analyses
S Sattarpanah Karganroudi, S Shojaei, R Hashemi… - Metals, 2021 - mdpi.com
In this article, the forming limit diagram (FLD) for aluminum 6061 sheets of thicknesses of 1
mm and 3 mm was determined numerically and experimentally, considering different punch …
mm and 3 mm was determined numerically and experimentally, considering different punch …
Electromigration effect on the Pd coated Cu wirebond
M Tajedini, AT Osmanson, YR Kim… - 2021 IEEE 71st …, 2021 - ieeexplore.ieee.org
Wirebonding with bare Cu and palladium-coated copper (PCC) wires have reemerged as
mainstream packaging technologies. This paper investigates the failure mechanisms in the …
mainstream packaging technologies. This paper investigates the failure mechanisms in the …
Observation of Fatigue and Creep Ratcheting Failure in Solder Joints under Pulsed Direct Current Electromigration Testing
AT Osmanson, YR Kim, CU Kim… - 2022 IEEE 72nd …, 2022 - ieeexplore.ieee.org
Recent electromigration (EM) testing of wafer-level chip scale packages (WCSPs) under
various duty factors (DFs) or pulse" on"/" off" ratio, of low-frequency pulsed-direct current …
various duty factors (DFs) or pulse" on"/" off" ratio, of low-frequency pulsed-direct current …
Study of SAC Solder Interconnect Parameters in Microelectronic Semiconductor Packaging and their Effects on Electromigration Failure Mechanisms
AT Osmanson - 2021 - mavmatrix.uta.edu
As the shrinkage of electronic devices becomes more appealing, so do their high capacity
and efficiency. This demand for ever-shrinking sizes of electronic devices follows the trend …
and efficiency. This demand for ever-shrinking sizes of electronic devices follows the trend …