Z Sun, S Yu, H Zhou, Y Liu… - IEEE Transactions on …, 2020 - ieeexplore.ieee.org
In this article, a novel full-chip EM simulation tool, called EMSpice simulator is proposed. The new method starts from first principles and simultaneously considers two major …
Electromigration (EM) becomes a major concern for VLSI circuits as the technology advances in the nanometer regime. With Korhonen equations, EM assessment for VLSI …
In this article, we present a novel approach to real-time tracking of full-chip heatmaps for commercial off-the-shelf microprocessors based on machine-learning. The proposed post …
Electromigration (EM) analysis for complicated interconnects requires the solving of partial differential equations, which is expensive. In this paper, we propose a fast transient …
Electromigration (EM) is considered to be one of the most important reliability issues for current and future ICs in 10-nm technology and below. In this article, we propose a fast …
In this paper, we propose a hot-spot aware Thermoelectric Cooler (TEC)-based active cooling technique, called TEC-Array, which can perform targeted cooling of the spatially and …
Considering temperature gradient or thermomigration (TM) impacts on electromigration (EM) due to Joule heating was less studied in the past. In this article, we propose a new semi …
This work proposes a new dynamic thermal and reliability management framework via task mapping and migration to improve thermal performance and reliability of commercial …
For practical testing and detection of electromigration (EM) induced failures in dual damascene copper interconnects, one critical issue is creating stressing conditions to …