The advance of semiconductor technology not only enables integrated circuits with higher
density and better performance but also increases their vulnerability to various aging …

In this article, a novel full-chip EM simulation tool, called EMSpice simulator is proposed.
The new method starts from first principles and simultaneously considers two major …

Electromigration (EM) becomes a major concern for VLSI circuits as the technology
advances in the nanometer regime. With Korhonen equations, EM assessment for VLSI …

In this article, we present a novel approach to real-time tracking of full-chip heatmaps for
commercial off-the-shelf microprocessors based on machine-learning. The proposed post …

Electromigration (EM) analysis for complicated interconnects requires the solving of partial
differential equations, which is expensive. In this paper, we propose a fast transient …

Electromigration (EM) is considered to be one of the most important reliability issues for
current and future ICs in 10-nm technology and below. In this article, we propose a fast …

In this paper, we propose a hot-spot aware Thermoelectric Cooler (TEC)-based active
cooling technique, called TEC-Array, which can perform targeted cooling of the spatially and …

Considering temperature gradient or thermomigration (TM) impacts on electromigration (EM)
due to Joule heating was less studied in the past. In this article, we propose a new semi …

This work proposes a new dynamic thermal and reliability management framework via task
mapping and migration to improve thermal performance and reliability of commercial …

For practical testing and detection of electromigration (EM) induced failures in dual
damascene copper interconnects, one critical issue is creating stressing conditions to …