Nanoelectronics is changing the way the world communicates, and is transforming our daily
lives. Continuing Moore's law and miniaturization of low-power semiconductor chips with …

The recent applications of 3D X-ray computed tomography (CT) in microelectronic
packages, including nondestructive failure analysis, defect monitoring in solder joints and …

A methodology for electronic non-destructive failure analysis of 3D-ICs is presented. The
method is centred on the Electro Optical Terahertz Pulse Reflectometry technique. Through …

Failure analysis (FA) could provide timely feedback to process optimization and solution
paths for system failures; thus, it is critical for the development of advanced driver assistance …

System in Package (SiP) technology is rapidly evolved from specialty technology used in a
narrow set of applications to a high volume technology with wide ranging impact on …

3D packaging has become a popular technology along with the tendency of functionality
and portability for electronic devices. Conventional fault isolation techniques face a great …

The package-on-package (PoP) stacking assembly is a member of the SiP family. It is
constructed by individual fabricated and tested packages from the same or different supplier …

We propose an innovative method that reduces the size of three-dimensional (3-D) volume
data while preserving important features in the data. Our method quantifies the importance …

Miniaturization and portability of consumer electronics is driving the substrate technology to
enable packages with higher circuit density, smaller size, and lower Z height. Cu vias with …

본 논문에서는 3D 볼륨 데이터에서 중요한 영역을 보존하면서 크기를 줄이는 방법을 제안한다.
볼륨 데이터에서 어느 부분이 중요한 영역인지를 결정하기 위해 질감 분석 방법 중 하나인 …