The reliability of SnAgCu (SAC)-based alloys has attracted considerable attention following
the restrictions on lead-based alloys in the electronics industry due to their toxic nature …

The electronics industry is increasingly prioritizing the reliability of SnAgCu (SAC)-based
alloys due to environmental concerns related to lead-based alloys. Considering the frequent …

The conversion from using tin-lead solder joint to lead-free solder joint has raised many pad
cratering failures for electronics manufacturing. This phenomenon has become more severe …

The transition of electronics manufacturing to lead-free soldering has led to the emergence
of pad cratering as an increasingly common failure mode. This first caused concern among …

This paper presents the drop test reliability results for edge-bonded 0.5 mm pitch lead-free
chip scale packages (CSPs) on a standard JEDEC drop reliability test board. The test …

Abstract The reliability of Chip Scale Package assembly is of great concern for the electronic
industry. Due to multiple function integration of the present devices there is a high demand …

Lead-free transition in the electronics industry, owing to the Restriction of Hazardous
Substances (RoHS), has resulted in the use of laminates which are harder and more brittle …

Low-silver SnAgCu alloys are quickly becoming the standard Pb-free solders for portable
electronic devices. However, the industry's quick adoption of near-eutectic SnAgCu alloys …

The electronics package trend is toward miniaturization. To meet the demand for high
bandwidth chips and to reduce I/O latency and energy consumption, advanced packages …