Info Packages Including Thermal Dissipation Blocks
C Lin, Y Chen, F Chang, P Huang… - US Patent App. 18 …, 2024 - Google Patents
US20240021441A1 - Info Packages Including Thermal Dissipation Blocks - Google Patents
US20240021441A1 - Info Packages Including Thermal Dissipation Blocks - Google Patents Info …
US20240021441A1 - Info Packages Including Thermal Dissipation Blocks - Google Patents Info …
Info packages including thermal dissipation blocks
CY Lin, YH Chen, FY Chang, PH Huang… - US Patent …, 2023 - Google Patents
A method includes forming a package, which includes forming a plurality of redistribution
lines over a carrier, and forming a thermal dissipation block over the carrier. The plurality of …
lines over a carrier, and forming a thermal dissipation block over the carrier. The plurality of …
Semiconductor package
J Choi, S Kang, T Kim, H Oh, C Jooyoung - US Patent 11,646,241, 2023 - Google Patents
(57) ABSTRACT A semiconductor package includes a connection structure having first and
second surfaces opposing each other and including a first redistribution layer; a …
second surfaces opposing each other and including a first redistribution layer; a …