Recent advancement of emerging nano copper-based printable flexible hybrid electronics

Z Li, S Chang, S Khuje, S Ren - ACS nano, 2021 - ACS Publications
Printed copper materials have been attracting significant attention prominently due to their
electric, mechanical, and thermal properties. The emerging copper-based flexible …

[HTML][HTML] Multi-material 3D printed electronic assemblies: A review

J Persad, S Rocke - Results in Engineering, 2022 - Elsevier
Printed circuit assemblies (PCAs) are an integral part of most modern electronic devices.
With the significant supply chain issues affecting the electronics industry there has been …

A Fully 3D Printed, Multi-Material, and High Operating Temperature Electromagnetic Actuator

S Mettes, J Bates, KW Allen… - 2023 IEEE/ASME …, 2023 - ieeexplore.ieee.org
Three-dimensional (3D) printing concepts that combine electrically conductive and
electrically insulating materials opens up new opportunities for the design and …

Fully 3D-Printed Multilayer Axial Flux Stator for Rotary Electromagnetic Motors

S Mettes, JF Schwalbe, KW Allen… - … ASME Transactions on …, 2024 - ieeexplore.ieee.org
Multimaterial additive manufacturing that combines electrically conductive materials with
thermally conductive, but electrically insulating materials presents new opportunities for …

Characterization of a 3D printed electric solenoid with multi-layer silver nanoparticle traces

S Mettes, N Kohls, KW Allen, YC Mazumdar - IFAC-PapersOnLine, 2022 - Elsevier
Abstract Multi-material three-dimensional (3D) printing methods that combine conductive
and non-conductive materials create new opportunities for the design of electrical circuits as …

Interconnection of Passive Components using Printed Aerosol-Jet Traces

P Lall, J Narangaparambil, K Schulze… - 2021 20th IEEE …, 2021 - ieeexplore.ieee.org
In this paper, process recipes for interconnection of passive components have been
developed using aerosol-jet printing and direct-write printing. Assembly of components on …

Process-Recipe Development for Printing of Multilayer Circuitry With Z-Axis Interconnects Using Aerosol-Jet Printed Dielectric Vias

P Lall, J Narangaparambil… - Journal of …, 2022 - asmedigitalcollection.asme.org
Flexible electronics is emerging as a new consumer-industry phenomenon. The promise of
additively printed flexible electronics has sparked interest in a detailed understanding of the …

Evaluation of Printed Logic Circuits With Additively Packaged GaN Bare Die Devices at High Temperatures

P Lall, V Soni, D Karakitie… - International …, 2024 - asmedigitalcollection.asme.org
Current electronics packaging is not designed to sustain and operate at high temperatures
above 150° C. However, in specialized applications, operation at extreme high and extreme …

Rapid Prototyping of Multiscale Flexible Printed Circuit Boards With NeXus, a Robotic Additive Manufacturing System

DT Sills, A Sherehiy, R Zhang… - Journal of Micro …, 2025 - asmedigitalcollection.asme.org
This paper demonstrates the NeXus system, a multiscale robotic additive manufacturing
platform developed at the Louisville Automation and Robotics Research Institute, as a rapid …

Development of Process-Recipes for Multi-Layer Circuitry Printing With Z-Axis Interconnects Using Aerosol-Jet Nanoparticle Ink

P Lall, J Narangaparambil… - International …, 2020 - asmedigitalcollection.asme.org
Flexible electronics is a rapid emerging trend in consumer-electronics with ever-increasing
applications showing feasibility of functionality with flexibility. Aerosol Jet printing technology …