Composite lead-free solders, containing micro and nano particles, have been widely
studied. Due to grain boundary drag or Zener drag, these particles can refrain the solder …

Lead-free soldering has emerged as one of the key technologies for assembling in
environmental-conscious electronics. Among several candidate alloys, the Sn–Ag–Cu alloy …

This paper reports on the interfacial reaction kinetics between molten Sn–58Bi solder and
Cu substrates for extended temporal scales. Also studied are the effects of a series of …

The tracer diffusion coefficients of the elements as well as the integrated interdiffusion
coefficients are determined for the Cu 3 Sn and Cu 6 Sn 5 intermetallic compounds using …

The formation and the growth of the intermetallic compound (IMC, hereafter) at the interface
between the Sn-3.5 Ag (numbers are all in wt.% unless otherwise specified) solder alloy and …

We present a systematic atomic scale analysis of the structural evolution of long-period-
stacking-ordered (LPSO) structures in the (i) α-Mg matrix and in the (ii) interdendritic LPSO …

As the most common of the intermetallic compounds (IMCs) formed between Sn-based
solders and Cu substrates during the packaging of integrated circuits (ICs), Cu 6 Sn 5 is …

The formation and growth of Cu–Sn intermetallic film at the interface between molten Sn–Pb
solders and Cu were studied at different temperature and exposure times. The η-phase …

Abstract The kinetics of Cu-Sn intermetallic compounds (IMCs) growth relates to the
materials preparation, process regulation and reliability prediction in the new energy field …

The microstructural evolution of η (Cu6Sn5) and ε (Cu3Sn) in a Cu/Sn/Cu structure under
transient liquid phase bonding conditions is numerically investigated through the use of the …