Embedded heat spreader for package with multiple microelectronic elements and face-down connection
W Zohni - US Patent 8,970,028, 2015 - Google Patents
4.941, 033. A 7, 1990 Kishida 5,148,265 A 9, 1992 Khandros et al. 5,148,266 A 9, 1992
Khandros et al. 5,347,159 A 9, 1994 Khandros et al. 5,480,840 A 1/1996 Barnes et al …
Khandros et al. 5,347,159 A 9, 1994 Khandros et al. 5,480,840 A 1/1996 Barnes et al …
Multiple die stacking for two or more die
W Zohni, B Haba - US Patent 8,952,516, 2015 - Google Patents
(63) Continuation-in-part of application No. 13/306.203, coioi, ie: 959): E filed on Nov. 29,
2011, now Pat. No. 8,633,576. 2225/06558 (2013.01); HOIL 2224/49.109 (60) Provisional …
2011, now Pat. No. 8,633,576. 2225/06558 (2013.01); HOIL 2224/49.109 (60) Provisional …
Simplified copper-copper bonding
L Di Cioccio, P Gueguen, M Rivoire - US Patent 8,647,983, 2014 - Google Patents
(57) ABSTRACT A method for bonding a first copper element onto a second copper element
including forming a crystalline copper layer enriched in oxygen on each of surfaces of each …
including forming a crystalline copper layer enriched in oxygen on each of surfaces of each …
Flip-chip, face-up and face-down wirebond combination package
B Haba, RDW Crisp, W Zohni - US Patent 9,093,291, 2015 - Google Patents
(57) A microelectronic assembly can include a substrate having an aperture extending
between first and second Surfaces thereof, the Substrate having Substrate contacts at the …
between first and second Surfaces thereof, the Substrate having Substrate contacts at the …
Flip-chip, face-up and face-down centerbond memory wirebond assemblies
B Haba, RDW Crisp, W Zohni - US Patent 8,928,153, 2015 - Google Patents
H01L 23/31(200601) A mlcroelectronlc assembly can 1nclude a substrate havmg H01L
25/10(2006 01)? rst and second surfaces and an aperture extending therebe HOIL …
25/10(2006 01)? rst and second surfaces and an aperture extending therebe HOIL …
Bare microelectronic chip provided with a recess forming a housing for a wire element constituting a flexible mechanical support, fabrication process and …
D Vicard, B Mourey, J Brun - US Patent 8,093,617, 2012 - Google Patents
(57) ABSTRACT A microelectronic chip comprises two parallel main faces and side faces. At
least one of the faces comprises a recess pro vided with at least one electrical connection …
least one of the faces comprises a recess pro vided with at least one electrical connection …
Semiconductor package
K Kim, SW Kang - US Patent 8,981,574, 2015 - Google Patents
A semiconductor package is provided comprising a package substrate having an opening
located in a central region thereof and a circuit pattern provided adjacent to the opening. A …
located in a central region thereof and a circuit pattern provided adjacent to the opening. A …
Chip package and method for forming the same
YL Huang, CY Lin, S Wei-Luen, CH Chen - US Patent 8,952,501, 2015 - Google Patents
An embodiment of the invention provides a chip package which includes: a semiconductor
Substrate having an upper Surface and a lower Surface; a device region or sensing region …
Substrate having an upper Surface and a lower Surface; a device region or sensing region …
Display device including a display module with connecting pins
KM Kim, S Moun, N Kim, H Kim, J Lee - US Patent 10,811,482, 2020 - Google Patents
(57) ABSTRACT A display device includes a first circuit substrate and an overlapping
second circuit. At least one connection pin is disposed in an opening in a base substrate …
second circuit. At least one connection pin is disposed in an opening in a base substrate …
Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics
B Haba, W Zohni, RDW Crisp - US Patent 8,553,420, 2013 - Google Patents
The present invention relates to stacked microelectronic assemblies and methods of making
Such assemblies, and to components useful in Such assemblies. Semiconductor chips are …
Such assemblies, and to components useful in Such assemblies. Semiconductor chips are …