Structures and techniques provide bond enhancement in microelectronics by trapping
contaminants and byproducts during bonding processes, and arresting cracks. Example …

A quantum computing system that includes a quantum circuit device having at least one
operating frequency; a first substrate having a first surface on which the quantum circuit …

Representative implementations of techniques and methods include processing singulated
dies in preparation for bonding. A plurality of semiconductor die components may be …

Representative implementations of techniques, methods, and formulary provide repairs to
processed semiconductor substrates, and associated devices, due to erosion or “dishing” of …

In a general aspect, an integrated quantum circuit includes a first substrate and a second
substrate. The first substrate includes a first surface and a recess formed in the first substrate …

Some variations provide an atomic vapor-cell system comprising: a vapor-cell region
configured with vapor-cell walls for containing an atomic vapor; and a coating disposed on …

(57) ABSTRACT A quantum computing system that includes a quantum circuit device having
at least one operating frequency; a first substrate having a first surface on which the …

Some variations provide an atomic vapor-cell system comprising: a vapor-cell region
configured with vapor-cell walls for containing an atomic vapor; and a coating disposed on …

Some variations provide an atomic vapor-cell system comprising: a vapor-cell region
configured with vapor-cell walls for containing an atomic vapor; and a coating disposed on …

In a general aspect, an integrated quantum circuit includes a first substrate and a second
substrate. The first substrate includes a first surface and a recess formed in the first substrate …