Self-sustainable biomedical devices powered by RF energy: A review

H Yahya Alkhalaf, M Yazed Ahmad, H Ramiah - Sensors, 2022 - mdpi.com
Wearable and implantable medical devices (IMDs) have come a long way in the past few
decades and have contributed to the development of many personalized health monitoring …

Nanotechnology-empowered flexible printed wireless electronics: A review of various applications of printed materials

A Eid, J Hester, Y Fang, B Tehrani… - IEEE …, 2018 - ieeexplore.ieee.org
In this article, the particular importance of nanotechnology-enabled materials associated
with additive manufacturing techniques for the realization of radio-frequency (RF) …

Inkjet-/3D-/4D-printed perpetual electronics and modules: RF and mm-wave devices for 5G+, IoT, smart agriculture, and smart cities applications

A Eid, X He, R Bahr, TH Lin, Y Cui… - IEEE Microwave …, 2020 - ieeexplore.ieee.org
With the revolutionary developments in the fields of millimeter-wave (mm-wave) and Internet
of Things (IoT) technologies and the billion devices promised to be implemented by the end …

Additively manufactured mm-wave multichip modules with fully printed “smart” encapsulation structures

X He, BK Tehrani, R Bahr, W Su… - IEEE Transactions on …, 2019 - ieeexplore.ieee.org
This article presents the first time that an millimeter-wave (mm-wave) multichip module
(MCM) with on-demand “smart” encapsulation has been fabricated utilizing additive …

[HTML][HTML] A surrogate modelling strategy to improve the surface morphology quality of inkjet printing applications

JF Reyes-Luna, S Chang, C Tuck, I Ashcroft - Journal of Manufacturing …, 2023 - Elsevier
Current trends in manufacturing electronics feature digital inkjet printing as a key technology
to enable the production of customised and microscale functional devices. However …

Advances in wirelessly powered backscatter communications: From antenna/RF circuitry design to printed flexible electronics

C Song, Y Ding, A Eid, JGD Hester, X He… - Proceedings of the …, 2021 - ieeexplore.ieee.org
Backscatter communication is an emerging paradigm for pervasive connectivity of low-
power communication devices. Wirelessly powered backscattering wireless sensor networks …

Fabrication of polyetheretherketone (PEEK)-based 3D electronics with fine resolution by a hydrophobic treatment assisted hybrid additive manufacturing method

L Wu, L Meng, Y Wang, M Lv, T Ouyang… - … Journal of Extreme …, 2023 - iopscience.iop.org
Additive manufacturing (AM) is a free-form technology that shows great potential in the
integrated creation of three-dimensional (3D) electronics. However, the fabrication of 3D …

A novel approach toward the integration of fully 3-D printed surface-mounted microwave ceramic filters

A Fontana, A Delage, A Périgaud… - IEEE Transactions …, 2023 - ieeexplore.ieee.org
A first approach toward the integration of heterogeneous electronic circuit technologies and
fully 3-D printed ceramic microwave devices is discussed in this work. Additive …

Fully inkjet-printed ramp interconnects for wireless Ka-band MMIC devices and multi-chip module packaging

BK Tehrani, MM Tentzeris - 2018 48th European Microwave …, 2018 - ieeexplore.ieee.org
This work outlines for the first time the development and demonstration of fully inkjet-printed
mm-wave 3D ramp interconnects for Ka-band active wireless devices and MCM packaging …

Achieving fully autonomous system-on-package designs: An embedded-on-package 5G energy harvester within 3D printed multilayer flexible packaging structures

TH Lin, SN Daskalakis, A Georgiadis… - 2019 IEEE MTT-S …, 2019 - ieeexplore.ieee.org
A novel multilayer flexible packaging fabrication process using only additively manufacturing
techniques including inkjet and 3 dimensional (3D) printing is proposed. The 3D printed …