The temperature‐dependent circuit modeling and performance in terms of propagation
delay, power dissipation, and crosstalk‐induced voltage waveform at the far end of victim …

An analytical model for the computation of equivalent capacitance in top‐contact and side‐
contact multilayer graphene nanoribbon interconnects is presented, taking into …

Abstract This study incorpates Density Functional Theory (DFT) to investigate the influence
of copper (Cu) and Iron (Fe) atom passivation on Boron Nitride Nanoribbons (ZBNRs) …

The continuous miniaturization and increasing complexity of semiconductor devices have
necessitated the development of advanced interconnect technologies. Graphene, a two …

In this work, we have presented the temperature-dependent analytical time domain model
for top-contact multilayer graphene nanoribbon (TC-MLGNR) and side-contact multilayer …

In this article, we provide an accurate method to determine the interlayer resistivity of 2-D
layered systems by directly measuring the resistance at a mono-to bi-layer step and feeding …

Proper interconnect selection has become challenging as technology is shrinking towards
dimensions of nanometer. They have a direct impact on power dissipation, time delay …

Semiconductor manufacturing is the workhorse for a wide range of industries. It lies at the
heart of consumer electronics, telecommunication equipment and medical devices. Most …

Modeling approaches are developed to optimize emerging on-chip and off-chip electrical
interconnect technologies and benchmark them against conventional technologies. While …

In this paper, we provide an accurate method to determine the interlayer resistivity of two-
dimensional layered systems by directly measuring the resistance at a mono-to bi-layer step …