With the continuous reduction of chip feature size, the continuation of Moore's Law becomes
increasingly difficult and heterogeneous integration has become one of the important …

As 3-D packaging is expected to meet new requirements for next-generation system-in-
packaging (SiP), various technologies have been discussed for vertical integration. To …

Cu–Cu bonding is a key process in fine pitch Cu interconnect in 3-dimenssional Si
integration. Despite the excellent electrical property and pattern ability of Cu material, the Cu …

Diffusion is one of the most critical and key factor for achieving low temperature and low
pressure thermocompression bonding. In this work, we propose a novel concept of …

The emerging 3D IC stacking technology as one of the main platforms for 3D integration
gains significant performance advantages by using copper (Cu) pillar interconnections …

Cu-to-Cu bonding is necessary for high density, fine-pitch interconnect and high bandwidth
in 3D stacking technology. Although various Cu-to-Cu bonding studies have been reported …

The increasing need for smaller, quicker devices that can perform new functions is driving
researchers to strictly adhere to Moore's law. To boost operating speed, the industry has …

Abstract Three Dimensional IC (3D IC) integration is one of the emerging technology which
suits CMOS applications by stacking various IC layers vertically. In 3D IC, IC Layers are …

One of India's fastest‐growing industries is the manufacturing sector centered on exports.
Additionally, it has a greater impact on the economic development of India. Technology in …

Over the period of meticulous scaling IC's are crucially waiting for a platform which is planar.
The most important and actual restriction is nothing, but delay of interconnect is almost …