Integrated circuit with dielectric waveguide connector using photonic bandgap structure
An encapsulated integrated circuit package is provided that includes an integrated circuit
(IC) die. A radio frequency (RF) circuit on the IC die is operable to send and/or receive an RF …
(IC) die. A radio frequency (RF) circuit on the IC die is operable to send and/or receive an RF …
Galvanic signal path isolation in an encapsulated package using a photonic structure
An encapsulated package is provided that includes a pair integrated circuit (IC) die. A radio
frequency (RF) circuit on one of the IC die is operable to transmit an RF signal having a …
frequency (RF) circuit on one of the IC die is operable to transmit an RF signal having a …
Spectrometry in integrated circuit using a photonic bandgap structure
An encapsulated package is provided that includes an inte grated circuit (IC) die. An
encapsulation material encapsu lates the IC die. A set of broadband spectral sensors on the …
encapsulation material encapsu lates the IC die. A set of broadband spectral sensors on the …
Thermal management in integrated circuit using phononic bandgap structure
An encapsulated integrated circuit is provided that includes an integrated circuit (IC) die. An
encapsulation material encapsulates the IC die. A phononic bandgap structure is included …
encapsulation material encapsulates the IC die. A phononic bandgap structure is included …
Acoustic management in integrated circuit using phononic bandgap structure
An encapsulated integrated circuit is provided that includes an integrated circuit (IC) die. A
phonon device is fabricated on the IC die that is configured to emit or to receive phonons …
phonon device is fabricated on the IC die that is configured to emit or to receive phonons …
Integrated circuit using photonic bandgap structure
On an integrated circuit (IC) die, sensors are configured to receive electromagnetic energy
and to generate signals in response to the electromagnetic energy. An encapsulation …
and to generate signals in response to the electromagnetic energy. An encapsulation …
Semiconductor package and method of manufacturing the same
J Oh, HK Kim, S Kim, SH Kim, YK Lee - US Patent 11,699,626, 2023 - Google Patents
A semiconductor package includes a package substrate, at least one semiconductor chip
mounted on the package substrate, and a molding member that surrounds the at least one …
mounted on the package substrate, and a molding member that surrounds the at least one …
Semiconductor device package comprising an encapsulated and conductively shielded semiconductor device die that provides an antenna feed to a waveguide
AHJ Kamphuis, AJM De Graauw, A Buijsman… - US Patent …, 2021 - Google Patents
A mechanism is provided to reduce a distance of a waveguide antenna from transmit and
receive circuitry in an integrated circuit device die. This distance reduction is performed by …
receive circuitry in an integrated circuit device die. This distance reduction is performed by …