Integrated circuit with dielectric waveguide connector using photonic bandgap structure

BS Cook, DL Revier - US Patent 10,371,891, 2019 - Google Patents
An encapsulated integrated circuit package is provided that includes an integrated circuit
(IC) die. A radio frequency (RF) circuit on the IC die is operable to send and/or receive an RF …

Galvanic signal path isolation in an encapsulated package using a photonic structure

BS Cook, DL Revier - US Patent 10,444,432, 2019 - Google Patents
An encapsulated package is provided that includes a pair integrated circuit (IC) die. A radio
frequency (RF) circuit on one of the IC die is operable to transmit an RF signal having a …

Spectrometry in integrated circuit using a photonic bandgap structure

BS Cook, DL Revier - US Patent 10,557,754, 2020 - Google Patents
An encapsulated package is provided that includes an inte grated circuit (IC) die. An
encapsulation material encapsu lates the IC die. A set of broadband spectral sensors on the …

Thermal management in integrated circuit using phononic bandgap structure

BS Cook, DL Revier - US Patent 10,886,187, 2021 - Google Patents
An encapsulated integrated circuit is provided that includes an integrated circuit (IC) die. An
encapsulation material encapsulates the IC die. A phononic bandgap structure is included …

Acoustic management in integrated circuit using phononic bandgap structure

DL Revier, BS Cook - US Patent 10,833,648, 2020 - Google Patents
An encapsulated integrated circuit is provided that includes an integrated circuit (IC) die. A
phonon device is fabricated on the IC die that is configured to emit or to receive phonons …

Integrated circuit using photonic bandgap structure

BS Cook, DL Revier - US Patent 10,788,367, 2020 - Google Patents
On an integrated circuit (IC) die, sensors are configured to receive electromagnetic energy
and to generate signals in response to the electromagnetic energy. An encapsulation …

Semiconductor package and method of manufacturing the same

J Oh, HK Kim, S Kim, SH Kim, YK Lee - US Patent 11,699,626, 2023 - Google Patents
A semiconductor package includes a package substrate, at least one semiconductor chip
mounted on the package substrate, and a molding member that surrounds the at least one …

Semiconductor device package comprising an encapsulated and conductively shielded semiconductor device die that provides an antenna feed to a waveguide

AHJ Kamphuis, AJM De Graauw, A Buijsman… - US Patent …, 2021 - Google Patents
A mechanism is provided to reduce a distance of a waveguide antenna from transmit and
receive circuitry in an integrated circuit device die. This distance reduction is performed by …