Co-designing electronics with microfluidics for more sustainable cooling
Thermal management is one of the main challenges for the future of electronics,,,–. With the
ever-increasing rate of data generation and communication, as well as the constant push to …
ever-increasing rate of data generation and communication, as well as the constant push to …
A Review of Recent Developments in “On-Chip” Embedded Cooling Technologies for Heterogeneous Integrated Applications
The electronics packaging community strongly believes that Moore's law will continue for
another few years due to recent technological efforts to build heterogeneously integrated …
another few years due to recent technological efforts to build heterogeneously integrated …
Single-phase and two-phase flow and heat transfer in microchannel heat sink with various manifold arrangements
The manifold microchannel (MMC) heat sink, which possesses better heat transfer
performance and less pressure drop than the traditional microchannel heat sink, has …
performance and less pressure drop than the traditional microchannel heat sink, has …
Investigation of Z-type manifold microchannel cooling for ultra-high heat flux dissipation in power electronic devices
Ultra-high heat flux (up to 1000 W/cm 2) thermal management has been an urgent need for
advanced power electronic devices to maintain their superior electrical performance and …
advanced power electronic devices to maintain their superior electrical performance and …
[HTML][HTML] A holistic approach to thermal-hydraulic design of 3D manifold microchannel heat sinks for energy-efficient cooling
Manifold microchannel heat sinks (MMCHSs) have attracted attention for the thermal
management of high-performance electronics owing to their high heat dissipation rate and …
management of high-performance electronics owing to their high heat dissipation rate and …
A comparative numerical study on two-phase boiling fluid flow and heat transfer in the microchannel heat sink with different manifold arrangements
The manifold microchannel (MMC) heat sink system has been widely used in high-heat-flux
chip thermal management due to its high surface-to-volume ratio. Two-phase, three …
chip thermal management due to its high surface-to-volume ratio. Two-phase, three …
Extreme heat flux cooling from functional copper inverse opal-coated manifold microchannels
The utilization of a hierarchical microstructure and three-dimensional (3D) manifold for liquid
delivery and liquid/vapor extraction could potentially improve the single-phase/two-phase …
delivery and liquid/vapor extraction could potentially improve the single-phase/two-phase …
The ICECool fundamentals effort on evaporative cooling of microelectronics
A Bar-Cohen, M Asheghi, TJ Chainer… - IEEE Transactions …, 2021 - ieeexplore.ieee.org
The Intrachip Enhanced Cooling Fundamentals (ICECool Fun) effort was launched by the
Defense Advanced Research Projects Agency (DARPA) under the leadership of Dr. Avram …
Defense Advanced Research Projects Agency (DARPA) under the leadership of Dr. Avram …
[HTML][HTML] Flexible microfluidic electrocaloric cooling capillary tube with giant specific device cooling power density
H Cui, Q Zhang, Y Bo, P Bai, M Wang, C Zhang, X Qian… - Joule, 2022 - cell.com
The microfluidic cooling system is one of the most promising micro-cooling solutions for chip-
scale thermal management, in which the regeneration of flowing cryogenic liquid is a key …
scale thermal management, in which the regeneration of flowing cryogenic liquid is a key …
Thermal management of GaN HEMT devices using subcooled flow boiling in an embedded manifold microchannel heat sink
Ultra-high heat flux thermal management has been an urgent demand for high electrical
performance and reliability of GaN HEMT electronic devices, and direct fabrication of …
performance and reliability of GaN HEMT electronic devices, and direct fabrication of …