Active and passive cooling are the two possible methods for removing heat. An active
cooling system is the one that involves the use of energy as opposed to passive cooling that …

New cooling techniques are being explored for the dissipation of heat fluxes. Many recent
studies on heat transfer in micro/minichannels (M/MCs) with nanofluids have focused on …

An improved design of wavy microchannel heat sink with changing wavelength or/and
amplitude along the flow direction is proposed. The thermal resistance R and the maximum …

To improve the heat transfer performances of microchannel heat sink (MCHS), the advanced
channel structures and working fluids can be applied. In this paper, the wavy channel …

In this study, a sinusoidal wavy structure of microchannel heat sink intended for active
cooling of compact electronic devices such as insulated-gate bipolar transistor (IGBT) has …

The hydraulic and thermal performance of microchannel heat sink configurations for high
performance electronic cooling applications is investigated by numerical modelling …

Thermal resistance and pumping power are two key metrics to evaluate the performance of
microchannel heat sinks. To reach their better performance, porous medium can serve as an …

In this study, heat transfer of a fin shaped microchannel heat sink (MCHS) cooled by Cu–
water nanofluid is investigated and temperature distribution in solid section (fin) and fluid …

Thermal management is restricting the further development of electronic devices. The rapid
development of communication and chip manufacturing technologies results in an …

The problem of generating a high amount of heat in microelectronic equipment should be
minimized properly. Allowing systems to run for long periods of time in high temperatures …