Chromophores with optimized second-order optical nonlinearity to optical loss ratios are
synthesized, poled with an electrical field, and coupled into hardened polymer matrixes …

Thermally expanded core (TEC) fiber is expected to reduce fiber-to-fiber and fiber-to-laser
diode connection loss. This paper describes the characteristics of TEC fiber theoretically and …

Soldering technology for optoelectronic packaging is reviewed by studying modules in four
categories: solder assembly with no precision self-alignments, and self-aligned solder …

The authors have fabricated an optical WDM module with a simple configuration using a
PLC platform together with a spot-size converted LD (SS-LD) and a waveguide PD (WG …

The continuing drive toward high-density, low-profile Integrated Circuit packaging has
accelerated the spread of flip-chip technology to laminated substrates, creating direct chip …

A method and apparatus for automatic passive alignment of optical waveguides with
photonic devices to provide for high volume production of optical components at low cost …

We describe a batch-assembled optoelectronic packaging technology based on silicon
surface-micromachined alignment mirrors and demonstrate that these mechanical structures …

Amethod is described for fabricating a module having a chip attached to a carrier Substrate,
wherein a guide Substrate transparent to ablation radiation is used. A removable layer is …

Compared with microelectronic packaging, optoelectronic packaging as a new packaging
type has been developed rapidly and it will play an essential role in optical communication …

We demonstrated some of the critical technology that is needed for the monolithic integration
of polymer electrooptic modulators and VLSI circuitry by fabricating and testing a phase slab …