Improved reliability of power modules: A review of online junction temperature measurement methods

N Baker, M Liserre, L Dupont… - IEEE Industrial …, 2014 - ieeexplore.ieee.org
Power electronic systems play an increasingly important role in providing high-efficiency
power conversion for adjustable-speed drives, power-quality correction, renewable-energy …

Reviewing thermal-monitoring techniques for smart power modules

S Kalker, LA Ruppert… - IEEE Journal of …, 2021 - ieeexplore.ieee.org
The increasing demand for higher power device utilization and reliability in power electronic
systems is driving the integration of condition monitoring and active control in power …

A junction temperature monitoring method for IGBT modules based on turn-off voltage with convolutional neural networks

H Wang, Z Xu, X Ge, Y Liao, Y Yang… - … on Power Electronics, 2023 - ieeexplore.ieee.org
Junction temperature monitoring (JTM) is essential for reliability evaluation and health
management for insulated-gate bipolar transistor (IGBT) modules, and thus is extensively …

Power cycling test methods for reliability assessment of power device modules in respect to temperature stress

UM Choi, F Blaabjerg… - IEEE Transactions on …, 2017 - ieeexplore.ieee.org
Power cycling test is one of the important tasks to investigate the reliability performance of
power device modules in respect to temperature stress. From this, it is able to predict the …

In situ diagnostics and prognostics of wire bonding faults in IGBT modules for electric vehicle drives

B Ji, V Pickert, W Cao, B Zahawi - IEEE Transactions on Power …, 2013 - ieeexplore.ieee.org
This paper presents a diagnostic and prognostic condition monitoring method for insulated-
gate bipolar transistor (IGBT) power modules for use primarily in electric vehicle …

Junction temperature extraction approach with turn-off delay time for high-voltage high-power IGBT modules

H Luo, Y Chen, P Sun, W Li, X He - IEEE Transactions on …, 2015 - ieeexplore.ieee.org
Thermo-sensitive electrical parameter (TSEP) approaches are widely employed in the
junction temperature extraction and prediction of power semiconductor devices. In this …

Real-time measurement of temperature sensitive electrical parameters in SiC power MOSFETs

A Griffo, J Wang, K Colombage… - IEEE Transactions on …, 2017 - ieeexplore.ieee.org
This paper examines a number of techniques for junction temperature estimation of silicon
carbide (SiC) MOSFET s devices based on the measurement of temperature sensitive …

A fast IGBT junction temperature estimation approach based on ON-state voltage drop

Y Yang, Q Zhang, P Zhang - IEEE Transactions on Industry …, 2020 - ieeexplore.ieee.org
Insulated gate bipolar transistor (IGBT) module is the most widely used power electronic
device in converters. Condition monitoring of IGBT is critical for avoiding sudden failures …

IGBT junction temperature estimation via gate voltage plateau sensing

CH van der Broeck, A Gospodinov… - IEEE Transactions on …, 2018 - ieeexplore.ieee.org
A method for in situ high-bandwidth junction temperature estimation of insulated-gate
bipolar transistors is introduced in this paper. The method is based on the acquisition of the …

An investigation of temperature-sensitive electrical parameters for SiC power MOSFETs

JO Gonzalez, O Alatise, J Hu, L Ran… - IEEE Transactions on …, 2016 - ieeexplore.ieee.org
This paper examines dynamic temperature-sensitive electrical parameters (TSEPs) for SiC
MOSFETs. It is shown that the switching rate of the output current (dI DS/dt) coupled with the …