Rapid advancements in nanotechnologies for energy conversion and transport applications
urgently require a further understanding of interfacial thermal transport and enhancement of …

Three distinct alloy/substrate couples were considered. In order to treat the reaction interface
problem effectively, sheets of commercially pure copper (Cu), electrolytic nickel (Ni) and low …

The numerical simulation and optimization in solidification involving geometries beyond one
dimension normally requires expensive computational approaches in memory and data …

Directional solidification experiments coupled with mathematical modelling, drop shape
analyses and evaluation of the reaction layers were performed for three different types of …

Adequate wetting is essential to generate high-quality solder connections. The wetting angle
(θ) is an important technical element in alloy selection and associated joining operations. In …

As a novel high-temperature solder with suitable eutectic temperature and high thermal
conductivity, Au-30Ga solder is expected to be used in high-power device packaging. This …

Although there are studies devoted to lower Indium (In) addition, Sn-Bi alloys containing 10
wt.% In or more have been barely investigated so far. Higher In contents may offer the …

Due to the health and environmental concerns associated with lead usage, the research on
alternative lead-free alloys for replacing lead-based solders is a global demand. Despite …

Abstract The growth of Cu 6 Sn 5 intermetallic compound (IMC) in Cu/Sn/Cu sandwich
system is investigated by thermal compression bonding under a temperature gradient of …

High-temperature lead-free Bi–11Ag solder with a Sn addition of 1, 3, and 5 wt% was
investigated in this paper. The results show that the melting temperature of Bi–11Ag solders …