A 13.5-Gb/s 140-GHz silicon redriver exploiting metadevices for short-range OOK communications

Y Liang, CC Boon, HC Zhang, XL Tang… - IEEE Transactions …, 2021 - ieeexplore.ieee.org
The effort to confine the electromagnetic field by silicon passive metadevices has made the
design of an on-chip wideband sub-terahertz (sub-THz) I/O redriver feasible, paving a new …

An energy-efficient and high-speed mobile memory I/O interface using simultaneous bi-directional dual (base+ RF)-band signaling

GS Byun, Y Kim, J Kim, SW Tam… - IEEE Journal of Solid …, 2011 - ieeexplore.ieee.org
A fully-integrated 8.4 Gb/s 2.5 pJ/b mobile memory I/O transceiver using simultaneous
bidirectionaldual band signaling is presented. Incorporating both RF-band and baseband …

Analysis of noncoherent ASK modulation-based RF-interconnect for memory interface

Y Kim, SW Tam, GS Byun, H Wu, L Nan… - IEEE Journal on …, 2012 - ieeexplore.ieee.org
A noncoherent amplitude shift keying (ASK)-based RF-interconnect (RF-I) system design for
off-chip communication is analyzed. The proposed RF-I system exploits the simple …

An 8Gb/s/pin 4pJ/b/pin Single-T-Line dual (base+ RF) band simultaneous bidirectional mobile memory I/O interface with inter-channel interference suppression

Y Kim, GS Byun, A Tang, CP Jou… - … Solid-State Circuits …, 2012 - ieeexplore.ieee.org
The demand for higher power efficiency and bandwidth is increasing as mobile devices
keep enhancing its graphic computing and media processing capabilities. Current memory …

The DIMM tree architecture: A high bandwidth and scalable memory system

K Therdsteerasukdi, GS Byun, J Ir… - 2011 IEEE 29th …, 2011 - ieeexplore.ieee.org
The demand for capacity and off-chip bandwidth to DRAM will continue to grow as we
integrate more cores onto a die. However, as the data rate of DRAM has increased, the …

IPOCIM: Artificial Intelligent Architecture Design Space Exploration With Scalable Ping-Pong Computing-in-Memory Macro

L Chang, X Zhao, T Yue, X Yang, C Li… - IEEE Transactions on …, 2023 - ieeexplore.ieee.org
Computing-in-memory (CIM) architecture has become a possible solution to designing an
energy-efficient artificial intelligent processor. Various CIM demonstrators indicated the …

Second-degree price discrimination for information goods under nonlinear utility functions

HK Bhargava, V Choudhary - Proceedings of the 34th Annual …, 2001 - ieeexplore.ieee.org
The paper studies second degree price discrimination for information goods. Prior research
in the context of traditional goods (where marginal costs are convex as a function of product …

A hybrid 3D interconnect with 2X bandwidth density employing orthogonal simultaneous bidirectional signaling for 3D NoC

S Gopal, S Das, PP Pande… - IEEE Transactions on …, 2020 - ieeexplore.ieee.org
For the first time, this work presents a wireless-wireline hybrid 3D interconnect that employs
orthogonal simultaneous bidirectional signaling for 3D Network-on-chip to achieve 2x …

A simultaneous bidirectional single-ended coaxial link with 24-Gb/s forward and 312.5-Mb/s back channels

A Manian, A Rane, Y Koh, HK Nat… - IEEE Journal of Solid …, 2020 - ieeexplore.ieee.org
A simultaneous bidirectional single-ended link is realized in TI's 130-nm BiCMOS
technology without any replica drivers. We measure a jitter tolerance of about 0.7 UIpp at 10 …

Siliconization of millimeter-wave to terahertz surface-plasmonic transceiver and phase-locked loops

Y Liang - 2022 - dr.ntu.edu.sg
The future 6G network and big-data center will be generating and capturing a wealth of data
that was previously unimaginable. The conventional inter-server interconnects rely on …