The rise of electric vehicles—2020 status and future expectations

M Muratori, M Alexander, D Arent, M Bazilian… - Progress in …, 2021 - iopscience.iop.org
Electric vehicles (EVs) are experiencing a rise in popularity over the past few years as the
technology has matured and costs have declined, and support for clean transportation has …

Integrated motor drives: state of the art and future trends

R Abebe, G Vakil, G Lo Calzo, T Cox… - IET Electric Power …, 2016 - Wiley Online Library
With increased need for high power density, high efficiency and high temperature
capabilities in aerospace and automotive applications, integrated motor drives (IMD) offers a …

The reliability of wire bonding using Ag and Al

M Schneider-Ramelow, C Ehrhardt - Microelectronics Reliability, 2016 - Elsevier
The combination of aluminum (Al) and silver (Ag) for wire bonding is long established:
aluminum (Al) heavy wire bonding on silver (Ag) metallization, such as pastes consisting of …

Reliability of copper, gold, silver, and PCC wirebonds subjected to harsh environment

P Lall, S Deshpande, L Nguyen - 2018 IEEE 68th Electronic …, 2018 - ieeexplore.ieee.org
Wire bonding is popular first-level interconnect method used in the semiconductor device
packaging. Gold (Ag) wire is often used in high-reliability applications. Typical wire …

A study on intermetallic compound formation in Ag–Al system and evaluation of its mechanical properties by micro-indentation

SW Fu, CC Lee - Journal of Materials Science: Materials in Electronics, 2018 - Springer
In electronic packaging in recent years, silver (Ag) alloy wires have been widely adopted in
wire-bond processes. The bond pads on the device chips are mostly aluminum (Al). Thus …

A corrosion study of Ag–Al intermetallic compounds in chlorine-containing epoxy molding compounds

SW Fu, CC Lee - Journal of Materials Science: Materials in Electronics, 2017 - Springer
Typical epoxy molding compounds (EMC) contain chlorine ions that cause silver wire-bond
failures under highly accelerated temperature/humidity stress test (HAST). To understand …

Towards automated statistical partial discharge source classification using pattern recognition techniques

H Janani, B Kordi - High Voltage, 2018 - Wiley Online Library
This study presents a comprehensive review of the automated classification in partial
discharge (PD) source identification and probabilistic interpretation of the classification …

Review on Corrosion in Electronic Packaging Trends of Collaborative between Academia–Industry

MA Bakar, A Atiqah, A Jalar - Sustainability, 2022 - mdpi.com
This article reviews corrosion in electronic packaging mainly in the semiconductor industry
over the world. The previous study was reviewed scientifically to highlight the significant …

The wetting characteristics of molten Ag–Cu–Au on Cu substrates: a molecular dynamics study

Y Yang, Y Liang, J Bi, Y Bai, S He, B Li - Physical Chemistry Chemical …, 2020 - pubs.rsc.org
Ag–Cu–Au ternary alloys are promising solder materials for wire bonding. Limited
experimental studies on Ag–Cu–Au materials can be found due to the high cost of gold. In …

Microstructural characterization of alloyed palladium coated copper wire under high temperature

M Eto, N Araki, T Yamada, M Sugiyama… - Microelectronics …, 2021 - Elsevier
Palladium coated copper (PCC) wire has been increasingly used in the semiconductor
package in the last 10 years, especially in consumer products as a low-cost alternative to …