[HTML][HTML] Eco-friendly preparation and characterization of highly thermally conductive polyimide/boron nitride composites

SW Jin, YJ Jin, YJ Choi, DB Kim, KH Yoon… - Composites Part A …, 2023 - Elsevier
In this paper, we report the eco-friendly preparation of polyimide/boron nitride (PI/BN)
composite sintered materials and the characterization of their thermally conductive …

Mechanical characterization of electrolyzer membranes and components under compression

C Arthurs, A Kusoglu - Journal of The Electrochemical Society, 2024 - iopscience.iop.org
Proton-exchange membrane (PEM) water electrolysis is a promising technology for
producing clean hydrogen by electrochemically splitting water when paired with renewable …

Physical characteristics of polyimide films for flexible sensors

WY Chang, TH Fang, YC Lin - Applied Physics A, 2008 - Springer
Physical characteristics of polyimide films, including optical, micro/nano mechanical, and
thermophysical characteristics were investigated using a photometric, a nanoindentation …

3D Stretchable Electronics with Stretchable Interlayer Connectors

D Jung, T Lee, S Cho, H Yoo, S Lee… - ACS Applied Materials …, 2024 - ACS Publications
The unique mechanical characteristics of stretchable electronics has significantly expanded
applications by overcoming the limitations (rigid, planar) of conventional electronics …

Effects of temperature, strain rate, and cyclic loading on mechanical behavior of silane‐modified polyurethane sealant

J Zhang, H Shen, H Li, L Gu - Journal of Applied Polymer …, 2021 - Wiley Online Library
To evaluate the mechanical properties of modified polyurethane sealants in engineering
applications, the influences of temperature, strain rate, and cyclic loading on the mechanical …

Quantitative evaluation of PI-RDL interfacial delamination in fan-out wafer-level packaging during unbiased highly accelerated stress test

W Wu, W Zhao, K Chen, B Ma, D Lu, K Wang… - Engineering Failure …, 2024 - Elsevier
Abstract Fan-Out Wafer-Level Packaging (FOWLP) is increasingly utilized for its superior
performance, facilitated by flexible heterogeneous integration. Despite its advantages, the …

Analysis of adhesion strength of laminated copper layers in roll-to-roll lamination process

J Lee, S Park, J Park, YS Cho, KH Shin… - International Journal of …, 2015 - Springer
The roll-to-roll (R2R) lamination process is a promising technology for the fabrication of
flexible electronic devices on large areas such as solar cells or organic light emitting diodes …

Extraction of Mechanical Parameters via Molecular Dynamics Simulation: Application to Polyimides

P Rosenauer, C Kratzer, S Larisegger, S Radl - Polymers, 2024 - mdpi.com
Polyimides feature a vast number of industrial applications due to their high thermal stability
and insulation properties. These polymers exhibit an exceptional combination of thermal …

In-situ CLSM characterization of deformation and fracture behavior of (Cu, Cr) metal thin films on flexible substrates

X Xue, C Zeng, S Wang, L Li - Surface Topography: Metrology …, 2022 - iopscience.iop.org
Magnetron sputter deposited Cu thin films on an insulating polymer substrate such as
polyimide are frequently used as flexible printed circuits. Understanding the tensile behavior …

Dramatic enhancement of carbon nanotube dispersion in polyimide composites by a two‐step amino functionalization approach

Y Chen, B Lin, H Yang, Y Sun… - Journal of Polymer …, 2013 - Wiley Online Library
Amino modified multiwall carbon nanotubes (MWNTs) are prepared, respectively, by two
ways: the conventional one‐step method that directly treats acyl chloride functionalized …